Details

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BUY FE2.1 LQFP48 https://www.utsource.net/itm/p/12610137.html

Parameter	Description
Package Type	LQFP48 (Low-profile Quad Flat Package with 48 pins)
Operating Temperature	-40°C to +85°C
Supply Voltage	3.3V ± 10%
I/O Structure	48-pin configuration
Power Consumption	Low power design suitable for battery-operated devices
Pin Pitch	0.8 mm
Body Size	7 mm × 7 mm
Packaging	Tape and reel
Mounting Type	Surface mount

Instructions for FE2.1 LQFP48

1. Handling Precautions:

   • Use proper ESD (Electrostatic Discharge) protection when handling the component.
   • Avoid exposing the package to high temperatures or humidity.

2. Soldering Guidelines:

   • Preheat the PCB to 125°C for 5 minutes before soldering.
   • Soldering temperature should not exceed 260°C.
   • Ensure that the soldering time does not exceed 10 seconds per pin.

3. Mounting Orientation:

   • Place the component on the PCB with the correct orientation as indicated by the pin 1 marker.
   • Verify the alignment of all pins before reflow soldering.

4. Storage Conditions:

   • Store in a dry environment, ideally below 60% relative humidity.
   • If stored for extended periods, bake the components at 125°C for 24 hours before use.

5. Testing Post Assembly:

   • Perform visual inspection to ensure no shorts or lifted pins.
   • Conduct electrical tests as per the datasheet specifications to verify functionality.

For detailed specifications and additional information, refer to the official datasheet provided by the manufacturer.

(For reference only)