Details

---

BUY HEF4011UBT https://www.utsource.net/itm/p/12610147.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VDD	3	-	15	V
Input Low Voltage	VIL	0	-	0.8	V
Input High Voltage	VIH	2.0	-	VDD	V
Output Low Voltage	VOL	0	0.4	0.5	V
Output High Voltage	VOH	2.4	-	VDD - 1.6	V
Input Leakage Current	IIL	-1	0	1	渭A
Output Leakage Current	IOL	-1	0	1	渭A
Propagation Delay Time	tpd	-	35	100	ns
Power Dissipation	PD	-	-	100	mW
Operating Temperature Range	TA	-40	-	85	掳C
Storage Temperature Range	TSTG	-65	-	150	掳C

Instructions for Use:

1. Power Supply:

   • Connect the V_DD pin to the positive supply voltage (3V to 15V).
   • Connect the GND pin to the ground.

2. Input Signals:

   • Ensure input signals are within the specified range (0V to V_DD).
   • Avoid applying voltages outside the V_IL and V_IH ranges to prevent damage.

3. Output Signals:

   • The output signals will be within the V_OL and V_OH ranges.
   • Ensure that the load connected to the output does not exceed the maximum current ratings.

4. Propagation Delay:

   • The propagation delay time (t_pd) is the time it takes for a change in the input signal to affect the output. It is typically around 35ns but can vary up to 100ns.

5. Temperature Considerations:

   • Operate the device within the specified operating temperature range (-40掳C to 85掳C) to ensure reliable performance.
   • Store the device within the storage temperature range (-65掳C to 150掳C).

6. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Use appropriate ESD protection when handling the device.

7. Mounting:

   • Ensure proper soldering techniques to avoid thermal stress on the device.
   • Use a heat sink if necessary to manage power dissipation, especially in high-power applications.

8. Testing:

   • Test the device under typical operating conditions to ensure it meets the specified parameters.
   • Refer to the datasheet for detailed test procedures and conditions.

(For reference only)