Details

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BUY FDP51N25 https://www.utsource.net/itm/p/12610161.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Drain-Source Voltage	VDS	-	-	250	V	-
Gate-Source Voltage	VGS	-20	-	20	V	-
Continuous Drain Current	ID	-	-	51	A	TC = 25掳C
Pulse Drain Current	ID(p)	-	-	130	A	tp = 10 渭s, TC = 25掳C
Power Dissipation	PD	-	-	210	W	TC = 25掳C
Junction Temperature	TJ	-	-	175	掳C	-
Storage Temperature Range	TSTG	-65	-	150	掳C	-
Total Device Dissipation	PTOT	-	-	210	W	TC = 25掳C
Gate Charge	QG	-	115	-	nC	VGS = 10V, ID = 51A
Input Capacitance	Ciss	-	1600	-	pF	VDS = 15V, f = 1MHz
Output Capacitance	Coss	-	390	-	pF	VDS = 15V, f = 1MHz
Reverse Transfer Capacitance	Crss	-	380	-	pF	VDS = 15V, f = 1MHz
On-State Resistance	RDS(on)	-	0.035	-	惟	VGS = 10V, ID = 51A

Instructions for Use:

1. Handling Precautions:

   • The FDP51N25 is sensitive to electrostatic discharge (ESD). Use proper ESD protection when handling the device.
   • Avoid exposing the device to temperatures outside the specified storage temperature range.

2. Mounting and Soldering:

   • Ensure that the PCB layout provides adequate heat dissipation to prevent the junction temperature from exceeding 175掳C.
   • Follow recommended soldering profiles to avoid thermal shock and damage to the device.

3. Biasing and Operation:

   • Apply gate-source voltage (V_GS) within the specified limits to ensure reliable operation.
   • Do not exceed the maximum drain-source voltage (V_DS) to prevent breakdown.
   • Ensure that the continuous drain current (I_D) does not exceed 51A at a case temperature of 25掳C.

4. Thermal Management:

   • Use appropriate heatsinks or cooling solutions to manage power dissipation and keep the junction temperature within safe limits.
   • Monitor the device temperature during operation to prevent overheating.

5. Testing and Measurement:

   • When testing the device, use the typical values provided in the table as a reference for expected performance.
   • Ensure that all test conditions match those specified in the datasheet for accurate results.

6. Storage and Packaging:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Follow recommended packaging guidelines to ensure the device remains protected during transportation and storage.

(For reference only)