Details

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BUY IDT72265L20PF https://www.utsource.net/itm/p/12610187.html

Parameter	Description	Value
Part Number	Full Part Number	IDT72265L20PF
Function	Device Type	16K x 9 Dual-Port RAM with 3.3V I/O and 2.5V Core
Memory Size	Total Memory	144 Kbits (16K x 9)
Supply Voltage	VCC (I/O)	3.3V 卤 0.3V
Supply Voltage	VCC (Core)	2.5V 卤 0.25V
Operating Temperature Range	Industrial	-40掳C to +85掳C
Access Time	tAA	10 ns (max)
Cycle Time	tCYC	10 ns (max)
Data Retention	tRET	20 years (min) at 25掳C
Power Consumption	Active	100 mW (typ)
Power Consumption	Standby	10 渭W (max)
Package	Package Type	44-Pin TQFP
Pin Pitch	Pin Pitch	0.8 mm
Operating Frequency	fMAX	100 MHz (max)
Input/Output	I/O Ports	9-bit wide
Write Protection	Write Protect	Optional
Data Bus Width	Data Bus Width	9 bits
Address Bus Width	Address Bus Width	14 bits
Clock Input	Clock Input	Differential or Single-Ended
Clock Skew	Clock Skew	卤100 ps (max)
Output Enable	Output Enable	Active Low
Write Enable	Write Enable	Active Low
Chip Select	Chip Select	Active Low
Package Material	Package Material	Lead-Free, Halogen-Free

Instructions for Use:

1. Power Supply:

   • Connect VCC (I/O) to a 3.3V supply.
   • Connect VCC (Core) to a 2.5V supply.
   • Ensure that the power supplies are stable and within the specified ranges.

2. Clock Input:

   • Use a differential clock input for optimal performance, or a single-ended clock if differential is not available.
   • Ensure the clock skew is within 卤100 ps to maintain timing integrity.

3. Address and Data Buses:

   • Connect the address lines (A0-A13) to the appropriate address bus.
   • Connect the data lines (D0-D8) to the data bus.
   • Ensure that the data bus width matches the 9-bit width of the device.

4. Control Signals:

   • Connect the chip select (CS), write enable (WE), and output enable (OE) signals to the appropriate control lines.
   • Active low signals should be pulled high when not in use.

5. Write Protection:

   • If write protection is required, connect the WP pin to VCC to disable writes.

6. Power Sequencing:

   • Apply VCC (Core) before VCC (I/O) to avoid potential damage.
   • Ensure that both power supplies are removed simultaneously during power-down.

7. Thermal Management:

   • Ensure adequate cooling for the device, especially under heavy load conditions.
   • The device is designed for industrial temperature ranges, but proper heat dissipation is crucial.

8. Storage and Handling:

   • Store the device in a dry, static-free environment.
   • Handle with care to avoid damage to the pins and package.

For detailed timing diagrams and additional specifications, refer to the datasheet provided by the manufacturer.

(For reference only)