IRFR7740TRPBF

IRFR7740TRPBF


Specifications
Details

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Parameter Symbol Test Conditions Min Typical Max Unit
Drain-Source On-Resistance RDS(on) VGS = 10V, ID = 4.2A 6.5 m惟
Gate Threshold Voltage VGS(th) ID = 250渭A 1.0 1.8 3.0 V
Continuous Drain Current ID TC = 25掳C 7.0 A
Pulse Drain Current IDM tp = 10ms, Duty = 1% 40.0 A
Total Power Dissipation PD TC = 25掳C 40.0 W
Junction Temperature TJ -55 150 掳C
Storage Temperature Range TSTG -55 150 掳C

Instructions for IRFR7740TRPBF:

  1. Handling Precautions: This device is sensitive to electrostatic discharge (ESD). Use proper ESD protection during handling and installation.
  2. Mounting: Ensure good thermal contact with the heat sink if operating at high current or power levels. Apply a suitable thermal interface material between the device and the heat sink.
  3. Operating Limits: Do not exceed the maximum ratings listed in the parameter table. Exceeding these limits can result in permanent damage to the device.
  4. Gate Drive Requirements: The gate threshold voltage (VGS(th)) defines the minimum gate-source voltage required to turn on the MOSFET. Ensure that the gate drive circuitry can provide sufficient voltage to fully enhance the MOSFET.
  5. Thermal Considerations: Monitor the junction temperature (TJ) to ensure it stays within specified limits. Proper cooling solutions may be necessary depending on the application.
  6. Storage and Handling: Store in a dry, cool place. Avoid exposure to high humidity and extreme temperatures.
(For reference only)

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