Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | Operating | 2.7 | - | 5.5 | V |
| Output Current | IOUT | Per Channel | - | 100 | - | mA |
| Quiescent Current | IQ | VDD = 5V | - | 1 | - | mA |
| Shutdown Current | ISD | VSD = 0V | - | 0.1 | - | 渭A |
| Thermal Shutdown | TSD | - | - | 150 | - | 掳C |
| Operating Temperature | TOPR | - | -40 | - | 85 | 掳C |
| Storage Temperature | TSTG | - | -65 | - | 150 | 掳C |
Instructions for TMPZ8004P-6
Supply Voltage Connection:
- Connect the supply voltage (VDD) within the range of 2.7V to 5.5V. Ensure stable power supply to avoid unexpected behavior.
Output Configuration:
- The device can provide up to 100mA per channel. Ensure the load connected does not exceed this limit to prevent damage.
Quiescent and Shutdown Current Management:
- In normal operation, the quiescent current is approximately 1mA at 5V.
- For minimal power consumption, use the shutdown feature which reduces current to about 0.1渭A when VSD is set to 0V.
Thermal Considerations:
- The device will automatically shut down if the temperature exceeds 150掳C to protect against thermal damage. Ensure adequate heat dissipation in high-power applications.
Temperature Range:
- Operate the device within the temperature range of -40掳C to +85掳C for optimal performance. Storage should be within -65掳C to +150掳C.
Handling Precautions:
- Handle with care to avoid electrostatic discharge (ESD). Use proper anti-static equipment when handling the component.
Installation:
- Follow standard surface mount technology (SMT) procedures for installation. Ensure all connections are secure and meet the specified parameters.
Testing:
- After installation, test the device under typical operating conditions to ensure it meets the required specifications.
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