Details

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BUY FMH23N50 https://www.utsource.net/itm/p/12610241.html

Parameter	Symbol	Min	Typical	Max	Unit	Description
Drain-Source Voltage	VDS	-	50	-	V	Maximum continuous drain-to-source voltage
Gate-Source Voltage	VGS	-10	0	10	V	Maximum gate-to-source voltage
Continuous Drain Current	ID	-	23	-	A	Maximum continuous drain current (Tc = 25掳C)
Pulse Drain Current	IDM	-	46	-	A	Maximum pulsed drain current (Tc = 25掳C, t = 10 渭s)
Power Dissipation	PTOT	-	120	-	W	Maximum total power dissipation (Tc = 25掳C)
Junction Temperature	TJ	-	-	175	掳C	Maximum junction temperature
Storage Temperature	TSTG	-55	-	150	掳C	Operating and storage temperature range
Thermal Resistance	R胃JC	-	0.9	-	掳C/W	Junction to case thermal resistance

Instructions for Use:

1. Voltage Ratings:

   • Ensure that the drain-source voltage (V_DS) does not exceed 50V.
   • The gate-source voltage (V_GS) should be kept within the range of -10V to +10V.

2. Current Handling:

   • The continuous drain current (I_D) should not exceed 23A at a case temperature of 25掳C.
   • For pulse applications, the peak drain current (I_DM) can reach up to 46A for a pulse duration of 10 渭s at a case temperature of 25掳C.

3. Power Dissipation:

   • The maximum total power dissipation (P_TOT) is 120W at a case temperature of 25掳C. Ensure adequate heat sinking to manage power dissipation.

4. Temperature Management:

   • The junction temperature (T_J) must not exceed 175掳C.
   • The device can operate and be stored within a temperature range of -55掳C to 150掳C.

5. Thermal Considerations:

   • The thermal resistance from the junction to the case (R_胃JC) is 0.9掳C/W. Proper heat sinking is essential to maintain the junction temperature within safe limits.

6. Handling and Storage:

   • Handle the device with care to avoid damage to the leads and the body.
   • Store the device in a dry environment within the specified temperature range to prevent moisture-related issues.

7. Mounting:

   • Ensure that the device is securely mounted to a heatsink or PCB to facilitate proper heat dissipation.
   • Follow the recommended soldering and mounting procedures to avoid thermal and mechanical stress.

8. Testing and Operation:

   • Test the device under controlled conditions to ensure it meets the specified parameters.
   • Monitor the operating conditions, especially temperature and current, to ensure reliable operation.

For more detailed information, refer to the datasheet provided by the manufacturer.

(For reference only)