Details
BUY GM71C18160CJ6 https://www.utsource.net/itm/p/12610260.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 1.7 | 3.6 | V | Operating voltage range | |
| Standby Current | ISB | 0.1 | 渭A | Supply current in standby mode | ||
| Active Current | IOP | 2 | mA | Supply current during active operation | ||
| Output Drive Capability | IOH | -8 | mA | Output high drive capability | ||
| IOL | 8 | mA | Output low drive capability | |||
| Input Leakage Current | IIH | 1 | 渭A | Input leakage current at VIH | ||
| IIL | 1 | 渭A | Input leakage current at VIL | |||
| Operating Temperature | Toper | -40 | 85 | 掳C | Operating temperature range | |
| Storage Temperature | Tstg | -65 | 150 | 掳C | Storage temperature range |
Instructions for GM71C18160CJ6
Power Supply Connection:
- Ensure the supply voltage (VCC) is within the specified range of 1.7V to 3.6V.
- Connect the ground (GND) pin to a stable reference ground.
Standby Mode:
- To enter standby mode, ensure that all inputs are set to a known state and minimize activity on the device to achieve the lowest standby current.
Active Operation:
- For optimal performance, operate within the recommended operating conditions, especially regarding supply voltage and temperature.
Input/Output Handling:
- Keep input signals within the valid logic levels to prevent excessive power consumption or potential damage.
- Respect the maximum output drive capabilities (IOH and IOL) to avoid damaging connected components.
Temperature Considerations:
- Operate the device within the specified operating temperature range (-40掳C to 85掳C).
- Store the device within the storage temperature range (-65掳C to 150掳C).
Handling Precautions:
- Handle with care to avoid electrostatic discharge (ESD), which can damage sensitive components.
- Follow proper soldering techniques to avoid thermal stress on the component.
Testing and Debugging:
- Use appropriate tools and methods for testing to ensure accurate measurements and avoid unnecessary stress on the device.
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