Details
BUY TD62384AP https://www.utsource.net/itm/p/12610265.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | Operating | 1.8 | - | 5.5 | V |
| Output Current | IO | Per output, Ta=25掳C | - | 100 | - | mA |
| Quiescent Current | IQ | VCC = 5V, No load | - | 1.5 | - | mA |
| Input Voltage Range | VIN | Operating | 0 | - | VCC | V |
| Maximum Power Dissipation | PD | Ta=25掳C | - | - | 430 | mW |
| Operating Temperature | TOPR | -40 | - | 85 | 掳C | |
| Storage Temperature | TSTG | -55 | - | 150 | 掳C |
Instructions for TD62384AP
Supply Voltage (VCC):
- Ensure the supply voltage is within the range of 1.8V to 5.5V to avoid damage or malfunction.
Output Current (IO):
- The device can source up to 100mA per output at room temperature (Ta=25掳C). Do not exceed this limit to prevent overheating or failure.
Quiescent Current (IQ):
- The typical quiescent current is 1.5mA when the supply voltage is 5V and there is no load. This value helps in power budget calculations.
Input Voltage Range (VIN):
- Inputs should be within the range of 0V to VCC to ensure proper operation and prevent latch-up conditions.
Power Dissipation (PD):
- Keep the power dissipation below 430mW at room temperature (Ta=25掳C) to maintain safe operating conditions.
Operating Temperature (TOPR):
- The device is designed to operate between -40掳C and 85掳C. Operating outside these temperatures may affect performance or reliability.
Storage Temperature (TSTG):
- Store the device between -55掳C and 150掳C. Avoid exposing the device to temperatures outside this range for extended periods.
Handling:
- Handle with care to avoid static discharge which can damage the sensitive components. Use appropriate ESD protection measures.
Mounting:
- Follow recommended PCB layout guidelines to ensure optimal thermal performance and electrical characteristics. Proper grounding and decoupling capacitors are essential.
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