TD62384AP

TD62384AP


Specifications
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 1.8 - 5.5 V
Output Current IO Per output, Ta=25掳C - 100 - mA
Quiescent Current IQ VCC = 5V, No load - 1.5 - mA
Input Voltage Range VIN Operating 0 - VCC V
Maximum Power Dissipation PD Ta=25掳C - - 430 mW
Operating Temperature TOPR -40 - 85 掳C
Storage Temperature TSTG -55 - 150 掳C

Instructions for TD62384AP

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 1.8V to 5.5V to avoid damage or malfunction.
  2. Output Current (IO):

    • The device can source up to 100mA per output at room temperature (Ta=25掳C). Do not exceed this limit to prevent overheating or failure.
  3. Quiescent Current (IQ):

    • The typical quiescent current is 1.5mA when the supply voltage is 5V and there is no load. This value helps in power budget calculations.
  4. Input Voltage Range (VIN):

    • Inputs should be within the range of 0V to VCC to ensure proper operation and prevent latch-up conditions.
  5. Power Dissipation (PD):

    • Keep the power dissipation below 430mW at room temperature (Ta=25掳C) to maintain safe operating conditions.
  6. Operating Temperature (TOPR):

    • The device is designed to operate between -40掳C and 85掳C. Operating outside these temperatures may affect performance or reliability.
  7. Storage Temperature (TSTG):

    • Store the device between -55掳C and 150掳C. Avoid exposing the device to temperatures outside this range for extended periods.
  8. Handling:

    • Handle with care to avoid static discharge which can damage the sensitive components. Use appropriate ESD protection measures.
  9. Mounting:

    • Follow recommended PCB layout guidelines to ensure optimal thermal performance and electrical characteristics. Proper grounding and decoupling capacitors are essential.
(For reference only)

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