Details

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BUY BUP313 https://www.utsource.net/itm/p/12610275.html

Parameter	Symbol	Min	Typical	Max	Unit
Forward Voltage	VF	-	1.8	-	V @ 20mA
Reverse Current	IR	-	100	-	nA @ 5V
Continuous Forward Current	IF	-	20	30	mA
Peak Forward Current	IF(surge)	-	100	-	mA (1/10 cycle)
Power Dissipation	PT	-	100	-	mW @ TA = 25掳C
Operating Temperature	TOP	-40	-	85	掳C
Storage Temperature	TSTG	-65	-	150	掳C
Thermal Resistance (Junction to Ambient)	R胃JA	-	250	-	K/W

Instructions for Use:

1. Forward Voltage (V_F):

   • Ensure that the forward voltage across the diode does not exceed 1.8V at 20mA to avoid damage.

2. Reverse Current (I_R):

   • The reverse current should be kept below 100nA at a reverse voltage of 5V to prevent leakage.

3. Continuous Forward Current (I_F):

   • The continuous forward current should not exceed 20mA to ensure reliable operation. However, it can handle up to 30mA for short periods.

4. Peak Forward Current (I_F(surge)):

   • The diode can handle peak forward currents up to 100mA, but only for very short durations (1/10 cycle).

5. Power Dissipation (P_T):

   • The power dissipation should not exceed 100mW at ambient temperatures of 25掳C to prevent overheating.

6. Operating Temperature (T_OP):

   • The device is designed to operate within a temperature range of -40掳C to 85掳C. Ensure that the operating environment stays within these limits.

7. Storage Temperature (T_STG):

   • When storing the device, ensure that the temperature remains between -65掳C and 150掳C to maintain its integrity.

8. Thermal Resistance (R_胃JA):

   • The thermal resistance from the junction to the ambient environment is 250K/W. Proper heat sinking may be required if the device is expected to dissipate significant power.

9. Handling Precautions:

   • Handle the device with care to avoid mechanical stress or damage.
   • Use appropriate ESD protection when handling the device to prevent electrostatic discharge damage.

10. Mounting:

    • Follow the recommended soldering profile to ensure proper mounting and to avoid thermal stress during soldering.
    • Ensure that the device is securely mounted to the PCB to prevent mechanical stress during operation.

(For reference only)