Details

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BUY IXFX140N30P https://www.utsource.net/itm/p/12610289.html

Parameter	Symbol	Value	Unit
Maximum Drain Voltage	VDS	300	V
Maximum Gate-Source Voltage	VGS	卤20	V
Maximum Drain Current (Pulsed)	ID(p)	140	A
Maximum Drain Current (Continuous)	ID(c)	60	A
Power Dissipation (TC=25掳C)	PTOT	270	W
Junction Temperature Range	TJ	-55 to 175	掳C
Storage Temperature Range	TSTG	-55 to 150	掳C
Thermal Resistance, Junction to Case	RthJC	0.45	掳C/W
Total Gate Charge	QG	150	nC
Input Capacitance	Ciss	2800	pF
Output Capacitance	Coss	390	pF
Reverse Transfer Capacitance	Crss	1000	pF
On-State Resistance at 25掳C	RDS(on)	0.035	惟
On-State Resistance at 100掳C	RDS(on)	0.055	惟
Turn-On Delay Time	td(on)	150	ns
Rise Time	tr	75	ns
Turn-Off Delay Time	td(off)	100	ns
Fall Time	tf	50	ns

Instructions for Use:

1. Handling Precautions:

   • Avoid exposing the device to excessive static electricity.
   • Handle with care to prevent mechanical damage.

2. Mounting:

   • Ensure proper heat sinking to manage thermal resistance.
   • Use recommended torque values for screw terminals to avoid over-tightening.

3. Biasing:

   • Apply gate-source voltage within the specified range to prevent damage.
   • Ensure the gate drive circuit is capable of providing sufficient current for fast switching.

4. Operation:

   • Do not exceed the maximum drain current or power dissipation ratings.
   • Operate within the specified junction temperature range to ensure reliable performance.

5. Storage:

   • Store in a dry, cool environment to prevent moisture damage.
   • Follow recommended storage temperature limits to maintain device integrity.

6. Testing:

   • Use appropriate test equipment and methods to verify parameters.
   • Refer to the datasheet for specific test conditions and procedures.

7. Safety:

   • Follow all safety guidelines when handling high-voltage and high-current circuits.
   • Ensure proper grounding and isolation to prevent electrical hazards.

(For reference only)