Details

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BUY LD7913JGM6 https://www.utsource.net/itm/p/12610338.html

Parameter	Symbol	Min	Typ	Max	Unit
Input Voltage	VIN	15	-	40	V
Output Voltage	VOUT	-	13.0	-	V
Output Current	IOUT	-	0.8	1.0	A
Quiescent Current	IQ	-	2.0	-	mA
Dropout Voltage	VDROPOUT	-	1.0	-	V
Thermal Shutdown	TSD	-	160	-	掳C
Operating Temperature	TOPR	-40	-	125	掳C
Storage Temperature	TSTG	-55	-	150	掳C

Instructions for Use

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 15V to 40V. Exceeding this range can damage the device.

2. Output Voltage (VOUT):

   • The output voltage is fixed at 13.0V. No external components are required to set this voltage.

3. Output Current (IOUT):

   • The device can provide up to 1.0A of output current, with a typical value of 0.8A. Ensure that the load does not exceed this limit to avoid overheating or damage.

4. Quiescent Current (IQ):

   • The quiescent current is typically 2.0mA. This is the current consumed by the regulator when no load is applied.

5. Dropout Voltage (VDROPOUT):

   • The dropout voltage is typically 1.0V. This means the input voltage must be at least 1.0V higher than the output voltage for proper regulation.

6. Thermal Shutdown (TSD):

   • The device will shut down if the temperature exceeds 160掳C to prevent damage. Ensure adequate heat dissipation to keep the device within safe operating temperatures.

7. Operating Temperature (TOPR):

   • The operating temperature range is from -40掳C to 125掳C. Ensure the device is used within this range to maintain reliability.

8. Storage Temperature (TSTG):

   • The storage temperature range is from -55掳C to 150掳C. Store the device in a dry environment to prevent moisture damage.

9. Mounting:

   • Mount the device on a suitable heatsink if it will be operating at high current levels or in high ambient temperatures.

10. Capacitors:

    • Use appropriate input and output capacitors to ensure stability and reduce ripple. Typically, a 10渭F ceramic capacitor on the input and a 10渭F ceramic capacitor on the output are recommended.

11. PCB Layout:

    • Ensure good thermal management by using a large copper area around the device to help dissipate heat.

12. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components. Use proper ESD protection practices.

(For reference only)