Details

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BUY MPQ6700 https://www.utsource.net/itm/p/12610354.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	2.5	-	5.5	V	Operating supply voltage range
Output Current	IOUT	-	100	300	mA	Maximum output current (depends on thermal conditions)
Quiescent Current	IQ	-	1.5	3.0	渭A	Quiescent current at no load
Dropout Voltage	VDO	-	200	300	mV	Typical dropout voltage at full load
Load Regulation	-	-	0.5	1.0	%	Change in output voltage with load current from 0 to 300 mA
Line Regulation	-	-	0.1	0.5	%	Change in output voltage with input voltage from 2.5V to 5.5V
Thermal Shutdown Temperature	TSD	-	160	180	掳C	Temperature at which the device shuts down to prevent damage
Operating Junction Temperature	TJ	-40	-	125	掳C	Range of operating junction temperatures
Storage Temperature	TSTG	-65	-	150	掳C	Range of storage temperatures

Instructions for Using the MPQ6700

1. Power Supply Connection:

   • Connect the positive terminal of the power supply to the V_IN pin.
   • Connect the negative terminal of the power supply to the GND pin.

2. Output Connection:

   • Connect the load to the V_OUT pin and GND.

3. Capacitors:

   • Place a 1 渭F ceramic capacitor between V_IN and GND as close to the MPQ6700 as possible to ensure stability.
   • Place a 1 渭F ceramic capacitor between V_OUT and GND to filter the output and improve transient response.

4. Thermal Management:

   • Ensure adequate heat dissipation if operating at high output currents to avoid exceeding the maximum junction temperature.
   • Use a heatsink or a PCB with a large copper area for better thermal performance.

5. Thermal Shutdown:

   • The device will automatically shut down if the junction temperature exceeds the thermal shutdown threshold (160掳C to 180掳C). It will restart once the temperature drops below the hysteresis point.

6. Operating Temperature:

   • Ensure that the operating junction temperature remains within the specified range (-40掳C to 125掳C).

7. Storage:

   • Store the device in a dry environment within the storage temperature range (-65掳C to 150掳C).

8. Handling:

   • Handle the device with care to avoid static damage. Use proper ESD protection when handling the device.

9. Testing:

   • Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications.

(For reference only)