Details

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BUY TC551001BPL-10 https://www.utsource.net/itm/p/12610365.html

Parameter	Description	Value
Device Type	1M x 8-bit CMOS SRAM	-
Supply Voltage (VCC)	Operating Supply Voltage Range	2.0 V to 3.6 V
Standby Current (ISB)	Typical Standby Current at VCC = 3.0 V	1 渭A (max)
Active Current (ICC)	Typical Active Current at VCC = 3.0 V, fCLK = 4 MHz	20 mA (max)
Access Time (tAC)	Access Time from Address Valid to Data Valid	55 ns (max)
Cycle Time (tCYC)	Minimum Cycle Time	70 ns (min)
Data Hold Time (tDH)	Data Hold Time after Clock Edge	10 ns (min)
Address Setup Time (tAS)	Address Setup Time before Clock Edge	20 ns (min)
Data Setup Time (tDS)	Data Setup Time before Clock Edge	20 ns (min)
Output Enable Time (tOE)	Output Enable Time	15 ns (max)
Write Enable Time (tWE)	Write Enable Time	15 ns (max)
Package Type	Package Style	SOP-28 (Small Outline Package)
Operating Temperature Range (TA)	Ambient Operating Temperature	-40掳C to +85掳C
Storage Temperature Range (TSTG)	Storage Temperature	-65掳C to +150掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the range of 2.0 V to 3.6 V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Clock Signal:

   • Apply a clock signal (fCLK) to the clock input pin. The maximum frequency is 4 MHz at VCC = 3.0 V.

3. Address and Data Lines:

   • Set up the address lines (A0-A19) with the desired memory address before the clock edge.
   • Ensure data lines (D0-D7) are stable during the write operation and held for the required hold time after the clock edge.

4. Control Signals:

   • Use the output enable (OE) and write enable (WE) signals to control read and write operations.
   • OE should be low to enable data output, and WE should be low to initiate a write operation.

5. Timing Considerations:

   • Respect the specified access time, cycle time, setup, and hold times to ensure reliable operation.
   • Refer to the timing diagram provided in the datasheet for more detailed timing requirements.

6. Handling and Storage:

   • Store the device in a dry environment within the specified storage temperature range.
   • Handle the device with care to avoid static damage. Use proper ESD protection practices.

7. Mounting and Soldering:

   • Follow recommended soldering profiles to avoid thermal stress.
   • Ensure proper alignment and secure mounting of the device on the PCB.

For detailed specifications and additional information, refer to the official datasheet provided by the manufacturer.

(For reference only)