Details

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BUY 1N6282AG https://www.utsource.net/itm/p/12610407.html

Parameter	Symbol	Min	Typ	Max	Unit
Reverse Voltage	VR	-	100	-	V
Forward Current	IF	-	1	-	A
Peak Forward Surge Current	IFSM	-	20	-	A
Power Dissipation	PD	-	5	-	W
Operating Temperature	Toper	-40	-	100	掳C
Storage Temperature	Tstg	-65	-	150	掳C
Junction Temperature	TJ	-40	-	150	掳C
Thermal Resistance (J-C)	R胃JC	-	5	-	掳C/W

Instructions for Use:

1. Reverse Voltage (VR):

   • Ensure that the reverse voltage applied to the diode does not exceed 100V to prevent breakdown.

2. Forward Current (IF):

   • The continuous forward current should not exceed 1A to avoid overheating and potential damage.

3. Peak Forward Surge Current (IFSM):

   • The diode can handle peak surge currents up to 20A, but this should be for very short durations to prevent thermal damage.

4. Power Dissipation (PD):

   • The power dissipation should not exceed 5W to maintain safe operating conditions.

5. Operating Temperature (Toper):

   • The diode is designed to operate within a temperature range of -40掳C to 100掳C. Ensure that the ambient temperature is within these limits.

6. Storage Temperature (Tstg):

   • Store the diode in an environment with temperatures ranging from -65掳C to 150掳C to ensure long-term reliability.

7. Junction Temperature (TJ):

   • The junction temperature should be kept between -40掳C and 150掳C to prevent thermal degradation.

8. Thermal Resistance (R胃JC):

   • The thermal resistance between the junction and the case is 5掳C/W. Proper heat sinking may be required to manage heat dissipation effectively.

Handling Precautions:

• ESD Sensitivity: Handle the diode with care to avoid electrostatic discharge (ESD), which can damage the device.
• Mounting: Ensure proper mounting techniques to minimize mechanical stress and improve thermal performance.
• Soldering: Follow recommended soldering profiles to avoid thermal shock and ensure a reliable connection.

(For reference only)