Details

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Parameter	Description	Value
Device Type	Programmable Array Logic with CMOS technology	PALCE16V8H-25PC/4
Package	Plastic Dual In-Line Package (PDIP)	20-Pin
Operating Voltage (VCC)	Supply voltage range	4.5 V to 5.5 V
Output Drive Current	Maximum output current per pin	±25 mA
Maximum Power Dissipation	Total power dissipation	330 mW
Operating Temperature Range	Commercial grade	0°C to +70°C
Storage Temperature Range	Storage temperature	-65°C to +150°C
Programming Voltage (VPP)	Programming voltage	12.6 V to 13.4 V
Programming Time	Typical time for programming	1 ms
Erasing Time	Typical time for erasing	10 ms
Number of Macrocells	Number of macrocells available for logic design	16
Input/Output Pins	Number of I/O pins	14
Clock Frequency	Maximum clock frequency	25 MHz
Logic Family	CMOS
Programmable Elements	AND array, OR array, and Output Logic Macrocells (OLMCs)	AND: 8 × 16, OR: 16 × 16
Programming Method	UV-erasable PROM (EPROM) technology
Polarity	Inputs and outputs can be programmed for positive or negative logic levels
Pin Configuration	Pin 1: VCC, Pin 10: GND, Pin 19: VPP, Pin 20: NC

Instructions for Use

1. Power Supply:

   • Connect VCC (Pin 1) to +5V.
   • Connect GND (Pin 10) to ground.
   • Connect VPP (Pin 19) to the programming voltage (12.6 V to 13.4 V) during programming.

2. Programming:

   • Use a compatible programmer to program the device.
   • Ensure the programming voltage (VPP) is applied correctly.
   • Follow the specific programming algorithm provided by the manufacturer.

3. Erasing:

   • Expose the device to UV light for at least 10 minutes to erase the contents.
   • Ensure the device is not powered during the erasing process.

4. Handling:

   • Handle the device with care to avoid static discharge.
   • Store the device in a dry and cool environment.

5. Testing:

   • After programming, test the device using a functional test setup to verify correct operation.
   • Check all input and output signals for proper logic levels.

6. Mounting:

   • Solder the device onto the PCB with appropriate soldering techniques.
   • Ensure good thermal management if operating near the maximum power dissipation.

7. Documentation:

   • Refer to the datasheet and application notes for detailed information on specific applications and advanced features.

(For reference only)