Details

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BUY SY8288BRAC https://www.utsource.net/itm/p/12610418.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	1.6	3.6	5.5	V
Operating Temperature	TOPR	-40		85	掳C
Storage Temperature	TSTG	-65		150	掳C
Input Voltage Range	VIN	1.6	3.6	5.5	V
Output Voltage	VOUT	1.2	3.6	5.5	V	Programmable via external resistors
Quiescent Current	IQ		10		渭A	No load
Load Regulation			1		%	10 mA to 150 mA
Line Regulation			1		%	VIN from 1.6V to 5.5V
Dropout Voltage	VDROPOUT		200		mV	At 150 mA
Output Current	IOUT		150		mA	Continuous
Ripple Rejection	RR		70		dB	1 kHz
PSRR (Power Supply Rejection Ratio)	PSRR		70		dB	100 kHz

Instructions for Use:

1. Supply Voltage (VCC):

   • Ensure the supply voltage is within the range of 1.6V to 5.5V.
   • Connect the VCC pin to the power source and GND to ground.

2. Output Voltage (VOUT):

   • The output voltage can be set using external resistors.
   • Use the formula: ( V_ = V_ left(1 + fracright) )
   • Where ( V_ ) is typically 1.2V.

3. Quiescent Current (IQ):

   • The quiescent current is very low, typically 10 渭A when no load is present.

4. Load Regulation:

   • The output voltage should remain stable within 1% when the load current changes from 10 mA to 150 mA.

5. Line Regulation:

   • The output voltage should remain stable within 1% when the input voltage changes from 1.6V to 5.5V.

6. Dropout Voltage:

   • The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It is typically 200 mV at 150 mA.

7. Output Current (IOUT):

   • The maximum continuous output current is 150 mA.

8. Ripple Rejection:

   • The device provides good ripple rejection, with a typical value of 70 dB at 1 kHz.

9. PSRR (Power Supply Rejection Ratio):

   • The PSRR is 70 dB at 100 kHz, indicating effective filtering of high-frequency noise.

10. Thermal Considerations:

    • Ensure adequate heat dissipation if operating at high temperatures or high output currents.
    • Refer to the thermal resistance data in the datasheet for detailed thermal management.

11. Layout Recommendations:

    • Keep the input and output capacitors close to the IC to minimize parasitic inductance.
    • Use a bypass capacitor (typically 10 渭F) on the input and output to improve stability and transient response.

12. Storage and Handling:

    • Store the device in a dry environment and handle with care to avoid damage from electrostatic discharge (ESD).

(For reference only)