Details

---

BUY KSH42C https://www.utsource.net/itm/p/12610430.html

Parameter	Description	Value
Part Number	Component Identifier	KSH42C
Type	Device Type	Schottky Diode
Package	Package Type	DO-214AC (SMA)
Maximum Reverse Voltage (VRM)	Maximum Reverse Voltage	40V
Maximum Forward Current (IFM)	Maximum Forward Current	1A
Forward Voltage (VF)	Forward Voltage at 1A	0.45V max
Reverse Recovery Time (trr)	Reverse Recovery Time	35 ns max
Operating Temperature Range (TJ)	Junction Temperature Range	-65掳C to +150掳C
Storage Temperature Range (TS)	Storage Temperature Range	-65掳C to +150掳C
Thermal Resistance (RthJ-A)	Thermal Resistance (Junction to Ambient)	150掳C/W
Capacitance (Cj)	Capacitance at 0V VR	70 pF max
Mounting Type	Mounting Method	Surface Mount

Instructions for Use

1. Handling and Storage:

   • Store in a dry, cool place to avoid moisture damage.
   • Handle with care to prevent mechanical stress on the leads.

2. Soldering:

   • Use a soldering iron with a temperature not exceeding 300掳C.
   • Soldering time should not exceed 10 seconds per joint.
   • Allow the device to cool naturally after soldering.

3. Electrical Connections:

   • Ensure correct polarity when connecting the diode.
   • Do not exceed the maximum reverse voltage (VRM) or forward current (IFM) ratings.
   • Use appropriate heat sinks if operating near the maximum power dissipation.

4. Mounting:

   • Ensure the PCB has a proper thermal path to dissipate heat.
   • Avoid bending the leads excessively as this can cause mechanical stress.

5. Testing:

   • Test the diode using a multimeter set to diode test mode to ensure proper functionality.
   • Check for continuity and forward voltage drop to verify correct operation.

6. Environmental Considerations:

   • Operate within the specified temperature range to ensure reliable performance.
   • Protect the device from excessive humidity and corrosive environments.

7. Disposal:

   • Follow local regulations for the disposal of electronic components.
   • Recycle where possible to minimize environmental impact.

(For reference only)