Details
BUY YG811S04 https://www.utsource.net/itm/p/12610444.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Input Voltage | Vin | 2.7 | - | 5.5 | V | Operating input voltage range |
| Output Voltage | Vout | - | 3.3 | - | V | Fixed output voltage |
| Output Current | Iout | - | - | 1 | A | Maximum continuous output current |
| Quiescent Current | Iq | - | 20 | - | μA | Quiescent current at no load |
| Dropout Voltage | Vdo | - | 100 | - | mV | Typical dropout voltage at 1A |
| Efficiency | η | - | 90 | - | % | Typical efficiency at 1A |
| Load Regulation | ΔVout | - | 1 | - | % | Load regulation from 0 to 1A |
| Line Regulation | ΔVout | - | 0.1 | - | %/V | Line regulation over input range |
| PSRR | - | - | 60 | - | dB | Power supply rejection ratio at 1kHz |
| Operating Temp | Toper | -40 | - | 85 | °C | Operating temperature range |
| Storage Temp | Tstg | -40 | - | 125 | °C | Storage temperature range |
Instructions for Use:
Input Connection:
- Connect the positive terminal of the power source to the
Vinpin. - Connect the negative terminal of the power source to the
GNDpin.
- Connect the positive terminal of the power source to the
Output Connection:
- Connect the load to the
Voutpin. - Ensure the load does not exceed the maximum output current of 1A.
- Connect the load to the
Capacitors:
- Place a 1μF ceramic capacitor between
VinandGNDas close to the regulator as possible to stabilize the input. - Place a 1μF ceramic capacitor between
VoutandGNDto stabilize the output.
- Place a 1μF ceramic capacitor between
Thermal Considerations:
- Ensure adequate heat dissipation if operating near the maximum output current, especially at higher ambient temperatures.
Efficiency:
- The efficiency is typically around 90% at 1A output current. Higher input voltages will reduce efficiency due to increased power loss.
Protection:
- The device includes thermal shutdown and short-circuit protection to prevent damage under abnormal conditions.
Storage and Handling:
- Store the device in a dry environment within the specified storage temperature range.
- Handle with care to avoid static discharge which can damage the component.
Mounting:
- Solder the device onto the PCB using standard surface mount technology (SMT) procedures.
- Ensure all solder joints are clean and free of flux residues.
Testing:
- After assembly, test the output voltage under various load conditions to ensure it meets the specifications.
- Verify that the quiescent current and dropout voltage are within the expected ranges.
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