Details
BUY EMB32N03K https://www.utsource.net/itm/p/12610566.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | 1.8 | - | 5.5 | V | Operating supply voltage range |
| Output Current | IO | - | 300 | - | mA | Maximum output current |
| Quiescent Current | IQ | - | 20 | - | 渭A | Typical quiescent current |
| Shutdown Current | ISD | - | 1 | - | 渭A | Shutdown mode supply current |
| Thermal Resistance | R胃JA | - | 120 | - | 掳C/W | Junction-to-ambient thermal resistance |
| Operating Temperature | Toper | -40 | - | 85 | 掳C | Operating temperature range |
| Storage Temperature | Tstg | -65 | - | 150 | 掳C | Storage temperature range |
Instructions for EMB32N03K
Power Supply Connection:
- Connect the VDD pin to a power supply within the specified voltage range (1.8V to 5.5V).
Output Configuration:
- Ensure that the load connected to the output does not exceed the maximum output current of 300mA.
Quiescent and Shutdown States:
- The device operates with a typical quiescent current of 20渭A.
- To enter shutdown mode, apply the appropriate signal to the control pin, reducing the current draw to approximately 1渭A.
Thermal Management:
- Consider the thermal resistance when designing the PCB layout to ensure adequate heat dissipation, especially under high load conditions.
Temperature Range:
- Operate the device within the specified operating temperature range (-40掳C to 85掳C) to ensure reliable performance.
- Store the device in environments where temperatures do not fall below -65掳C or rise above 150掳C.
Handling Precautions:
- Handle the device with care to avoid damage from electrostatic discharge (ESD).
- Follow standard procedures for soldering and mounting surface-mount devices.
View more about EMB32N03K on main site
