Details
BUY 1117S-2.5 https://www.utsource.net/itm/p/12610593.html
| Parameter | Value |
|---|---|
| Device Type | Low Dropout Linear Regulator |
| Output Voltage (Vout) | 2.5V |
| Input Voltage Range (Vin) | 2.7V to 13.8V |
| Maximum Output Current (Iout) | 1A |
| Quiescent Current (Iq) | 5mA (typical) |
| Dropout Voltage (Vdo) | 1.3V (max at 1A) |
| Operating Temperature (Toper) | -40掳C to +125掳C |
| Storage Temperature (Tstg) | -65掳C to +150掳C |
| Package Type | TO-220, SOT-223, SOT-89 |
| Thermal Resistance (胃JA) | 50掳C/W (TO-220) |
| Protection Features | Overcurrent Protection, Thermal Shutdown |
Instructions for Use
Circuit Design:
- Connect the input capacitor (typically 1渭F ceramic) close to the input pin.
- Connect the output capacitor (typically 10渭F tantalum or 10渭F ceramic) close to the output pin.
- Ensure the input voltage is within the specified range (2.7V to 13.8V).
Heat Dissipation:
- For high current applications, use a heatsink to manage thermal resistance.
- The thermal resistance (胃JA) should be considered to ensure the device does not exceed its maximum operating temperature.
Stability:
- The output capacitor must have an ESR (Equivalent Series Resistance) between 1惟 and 10惟 for stability. If using a low ESR capacitor, add a series resistor (1惟 to 10惟) to the output capacitor.
Overcurrent and Thermal Protection:
- The device has built-in overcurrent and thermal shutdown protection. Ensure that the load does not exceed the maximum output current and that the operating temperature remains within the specified range.
PCB Layout:
- Keep the PCB traces short and wide to minimize parasitic inductance and resistance.
- Ensure proper grounding and decoupling to reduce noise and improve performance.
Storage and Handling:
- Store the device in a dry, cool place.
- Handle with care to avoid damage to the leads and package.
Testing:
- Before finalizing the design, test the regulator under various conditions to ensure it meets the required specifications.
- Verify the output voltage, current, and temperature stability during testing.
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