Details
BUY STK4112II https://www.utsource.net/itm/p/12610608.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | 4.5 | 5.0 | 5.5 | V | Operating voltage range |
| Output Current | Iout | - | 1.5 | 3.0 | A | Maximum continuous output current |
| Peak Output Current | Ipeak | - | - | 5.0 | A | Maximum peak output current (pulsed) |
| Thermal Shutdown Temperature | TSD | 140 | - | 160 | 掳C | Temperature at which thermal shutdown is activated |
| Operating Temperature Range | Topr | -40 | - | 85 | 掳C | Ambient temperature range for operation |
| Storage Temperature Range | Tstg | -65 | - | 150 | 掳C | Temperature range for storage |
| Power Dissipation | Pd | - | 10 | 15 | W | Maximum power dissipation at 25掳C ambient |
| Thermal Resistance (Junction to Case) | R胃JC | - | 1.5 | - | 掳C/W | Thermal resistance from junction to case |
| Thermal Resistance (Junction to Ambient) | R胃JA | - | 30 | - | 掳C/W | Thermal resistance from junction to ambient |
Instructions for STK4112II
Supply Voltage:
- Ensure the supply voltage (Vcc) is within the range of 4.5V to 5.5V to avoid damage to the device.
Output Current:
- The device can provide a continuous output current up to 3.0A. For higher currents, ensure the application does not exceed the peak output current of 5.0A for extended periods.
Thermal Management:
- Monitor the operating temperature to prevent it from exceeding 85掳C. Use appropriate heat sinks or cooling methods to maintain the temperature within safe limits.
- The device will automatically shut down if the junction temperature reaches 140掳C to 160掳C to prevent thermal damage.
Storage and Handling:
- Store the device in a temperature range of -65掳C to 150掳C.
- Handle with care to avoid mechanical stress or damage.
Power Dissipation:
- The maximum power dissipation at 25掳C ambient is 15W. Ensure adequate cooling to manage power dissipation in high-current applications.
Mounting:
- Use a suitable heatsink to improve thermal performance, especially in high-power applications.
- Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
Electrostatic Discharge (ESD) Protection:
- Handle the device with ESD protection measures to prevent damage from static electricity.
Testing and Validation:
- Perform thorough testing under all expected operating conditions to ensure the device meets the required specifications and performance criteria.
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