Details

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BUY MBI5026GD https://www.utsource.net/itm/p/12610636.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VDD	4.75	5.0	5.25	V	-
Output Current per Channel	IO	0	120	150	mA	Continuous, Ta = 25°C
Peak Output Current per Channel	IOPK	-	160	200	mA	Pulse Width ≤ 1 ms, Duty Cycle ≤ 5%
Input Voltage Range	VIN	0	-	VDD	V	-
High-Level Input Voltage	VIH	3.5	-	VDD	V	-
Low-Level Input Voltage	VIL	0	-	1.5	V	-
High-Level Output Voltage	VOH	4.4	-	VDD - 0.1	V	IO = 150 mA, Ta = 25°C
Low-Level Output Voltage	VOL	0	-	0.5	V	IO = 150 mA, Ta = 25°C
Power Dissipation	PD	-	-	1500	mW	Ta = 25°C
Operating Temperature Range	TOPR	-40	25	85	°C	-
Storage Temperature Range	TSTG	-65	-	150	°C	-

Instructions for Using MBI5026GD

1. Supply Voltage (VDD):

   • Ensure the supply voltage is within the range of 4.75V to 5.25V.
   • Use a stable power source to avoid fluctuations that could affect performance.

2. Output Current (IO):

   • The continuous output current per channel should not exceed 150mA.
   • For peak currents up to 200mA, ensure the pulse width is ≤ 1ms and the duty cycle is ≤ 5%.

3. Input Voltage Range (VIN):

   • The input voltage should be between 0V and VDD.
   • Ensure high-level input voltages (VIH) are at least 3.5V and low-level input voltages (VIL) are no more than 1.5V for reliable operation.

4. Output Voltage Levels:

   • When sourcing 150mA, the high-level output voltage (VOH) should be at least 4.4V.
   • When sinking 150mA, the low-level output voltage (VOL) should be no more than 0.5V.

5. Power Dissipation (PD):

   • The maximum power dissipation is 1500mW at 25°C ambient temperature.
   • Ensure adequate heat dissipation if operating near this limit.

6. Operating Temperature (TOPR):

   • The device is designed to operate between -40°C and 85°C.
   • Avoid operating outside this range to prevent damage or reduced performance.

7. Storage Temperature (TSTG):

   • Store the device between -65°C and 150°C to ensure long-term reliability.

8. Handling Precautions:

   • Handle with care to avoid static discharge, which can damage the device.
   • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.

9. Mounting:

   • Ensure proper mounting to a suitable PCB with appropriate thermal management.
   • Use recommended soldering profiles to avoid thermal stress.

10. Testing:

    • Perform initial testing under controlled conditions to verify correct operation.
    • Monitor performance parameters regularly to ensure ongoing reliability.

(For reference only)