IRFS730B

IRFS730B


Specifications
SKU
12610678
Details

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Parameter Symbol Min Typical Max Unit Conditions
Drain-Source Voltage VDS - 55 - V -
Gate-Source Voltage VGS -15 - 15 V -
Continuous Drain Current ID - 6.8 - A TC = 25掳C
Continuous Drain Current ID - 4.5 - A TC = 100掳C
Pulse Drain Current IDM - 24 - A tp = 10 渭s, RG = 1 惟
Total Power Dissipation PTOT - 110 - W TC = 25掳C
Junction Temperature TJ - - 150 掳C -
Storage Temperature Range TSTG -55 - 150 掳C -
Gate Charge QG - 25 - nC VGS = 10 V
Input Capacitance Ciss - 2200 - pF VDS = 25 V
Output Capacitance Coss - 960 - pF VDS = 25 V
Reverse Transfer Capacitance Crss - 1240 - pF VDS = 25 V
On-State Resistance RDS(on) - 0.047 - VGS = 10 V, ID = 6.8 A, TC = 25掳C
Threshold Voltage VGS(th) 2.0 2.8 4.0 V ID = 250 渭A, TA = 25掳C
Maximum Gate Current IGM - - 10 A -

Instructions for Use:

  1. Mounting and Handling:

    • Ensure proper heat sinking to manage the power dissipation.
    • Handle with care to avoid static damage; use ESD protection.
  2. Biasing:

    • Apply gate-source voltage (VGS) within the specified range to control the drain current (ID).
    • Ensure that the gate-source voltage does not exceed the maximum ratings to prevent damage.
  3. Thermal Management:

    • Monitor the junction temperature (TJ) to ensure it stays below 150掳C.
    • Use appropriate cooling methods such as heatsinks or forced air cooling.
  4. Pulse Operation:

    • For pulse applications, ensure that the pulse duration (tp) and gate resistance (RG) are within the specified limits to avoid overheating.
  5. Storage:

    • Store the device in a dry, cool environment within the storage temperature range (-55掳C to 150掳C).
  6. Testing:

    • During testing, apply voltages and currents within the specified limits to avoid damaging the device.
    • Use proper test equipment and procedures to ensure accurate measurements.
  7. Soldering:

    • Follow recommended soldering profiles to avoid thermal stress.
    • Allow sufficient time for the device to cool down after soldering.
(For reference only)

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