Details
BUY IRFS730B https://www.utsource.net/itm/p/12610678.html
| Parameter | Symbol | Min | Typical | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | 55 | - | V | - |
| Gate-Source Voltage | VGS | -15 | - | 15 | V | - |
| Continuous Drain Current | ID | - | 6.8 | - | A | TC = 25掳C |
| Continuous Drain Current | ID | - | 4.5 | - | A | TC = 100掳C |
| Pulse Drain Current | IDM | - | 24 | - | A | tp = 10 渭s, RG = 1 惟 |
| Total Power Dissipation | PTOT | - | 110 | - | W | TC = 25掳C |
| Junction Temperature | TJ | - | - | 150 | 掳C | - |
| Storage Temperature Range | TSTG | -55 | - | 150 | 掳C | - |
| Gate Charge | QG | - | 25 | - | nC | VGS = 10 V |
| Input Capacitance | Ciss | - | 2200 | - | pF | VDS = 25 V |
| Output Capacitance | Coss | - | 960 | - | pF | VDS = 25 V |
| Reverse Transfer Capacitance | Crss | - | 1240 | - | pF | VDS = 25 V |
| On-State Resistance | RDS(on) | - | 0.047 | - | 惟 | VGS = 10 V, ID = 6.8 A, TC = 25掳C |
| Threshold Voltage | VGS(th) | 2.0 | 2.8 | 4.0 | V | ID = 250 渭A, TA = 25掳C |
| Maximum Gate Current | IGM | - | - | 10 | A | - |
Instructions for Use:
Mounting and Handling:
- Ensure proper heat sinking to manage the power dissipation.
- Handle with care to avoid static damage; use ESD protection.
Biasing:
- Apply gate-source voltage (VGS) within the specified range to control the drain current (ID).
- Ensure that the gate-source voltage does not exceed the maximum ratings to prevent damage.
Thermal Management:
- Monitor the junction temperature (TJ) to ensure it stays below 150掳C.
- Use appropriate cooling methods such as heatsinks or forced air cooling.
Pulse Operation:
- For pulse applications, ensure that the pulse duration (tp) and gate resistance (RG) are within the specified limits to avoid overheating.
Storage:
- Store the device in a dry, cool environment within the storage temperature range (-55掳C to 150掳C).
Testing:
- During testing, apply voltages and currents within the specified limits to avoid damaging the device.
- Use proper test equipment and procedures to ensure accurate measurements.
Soldering:
- Follow recommended soldering profiles to avoid thermal stress.
- Allow sufficient time for the device to cool down after soldering.
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