ZXTP5401GTA

ZXTP5401GTA


Specifications
Details

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Parameter Symbol Conditions Min Typ Max Unit
Drain-Source Breakdown Voltage V(BR)DSS ID = 250 μA, TD = 25°C 50 - 60 V
Gate-Source Breakdown Voltage V(BR)GSS ID = 1 mA, TD = 25°C ±2.5 - ±2.5 V
Forward Transconductance gfs VGS = 4.5 V, ID = 300 mA - 400 - mS
Input Capacitance Ciss VDS = 10 V, f = 1 MHz - 780 - pF
Output Capacitance Coff VGS = 0 V, f = 1 MHz - 55 - pF
Total Gate Charge Qg VGS = 4.5 V, ID = 300 mA - 20 - nC
Threshold Voltage VGS(th) ID = 250 μA, TD = 25°C 0.8 1.2 1.6 V

Instructions for ZXTP5401GTA

  1. Handling Precautions:

    • The ZXTP5401GTA is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and assembly.
  2. Mounting:

    • Ensure the mounting surface is clean and free from contaminants.
    • Apply thermal paste or a thermal pad between the device and heatsink if necessary for optimal heat dissipation.
  3. Operating Conditions:

    • Operate within specified voltage and current limits to prevent damage.
    • Ensure ambient temperature does not exceed maximum ratings.
  4. Storage:

    • Store in original packaging in a dry environment away from direct sunlight.
    • Follow first-in-first-out (FIFO) inventory management to ensure freshness.
  5. Testing:

    • Verify all connections are secure before applying power.
    • Perform initial testing under controlled conditions to validate operation.
  6. Application Notes:

    • Refer to the manufacturer’s application notes for detailed design considerations and circuit recommendations.
    • For high-frequency applications, minimize lead lengths to reduce parasitic inductances.
(For reference only)

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