Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | V(BR)DSS | ID = 250 μA, TD = 25°C | 50 | - | 60 | V |
| Gate-Source Breakdown Voltage | V(BR)GSS | ID = 1 mA, TD = 25°C | ±2.5 | - | ±2.5 | V |
| Forward Transconductance | gfs | VGS = 4.5 V, ID = 300 mA | - | 400 | - | mS |
| Input Capacitance | Ciss | VDS = 10 V, f = 1 MHz | - | 780 | - | pF |
| Output Capacitance | Coff | VGS = 0 V, f = 1 MHz | - | 55 | - | pF |
| Total Gate Charge | Qg | VGS = 4.5 V, ID = 300 mA | - | 20 | - | nC |
| Threshold Voltage | VGS(th) | ID = 250 μA, TD = 25°C | 0.8 | 1.2 | 1.6 | V |
Instructions for ZXTP5401GTA
Handling Precautions:
- The ZXTP5401GTA is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and assembly.
Mounting:
- Ensure the mounting surface is clean and free from contaminants.
- Apply thermal paste or a thermal pad between the device and heatsink if necessary for optimal heat dissipation.
Operating Conditions:
- Operate within specified voltage and current limits to prevent damage.
- Ensure ambient temperature does not exceed maximum ratings.
Storage:
- Store in original packaging in a dry environment away from direct sunlight.
- Follow first-in-first-out (FIFO) inventory management to ensure freshness.
Testing:
- Verify all connections are secure before applying power.
- Perform initial testing under controlled conditions to validate operation.
Application Notes:
- Refer to the manufacturer’s application notes for detailed design considerations and circuit recommendations.
- For high-frequency applications, minimize lead lengths to reduce parasitic inductances.
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