Details

---

BUY ADUM1401BRWZ https://www.utsource.net/itm/p/12610727.html

Parameter	Description	Min	Typical	Max	Unit
Supply Voltage (VDD1)	Input Supply Voltage	3.0	-	5.5	V
Supply Voltage (VDD2)	Output Supply Voltage	3.0	-	5.5	V
Isolation Voltage	Working Isolation Voltage	-	2500	-	Vrms
Channel-to-Channel Isolation	Channel-to-Channel Isolation	-	2500	-	Vrms
Propagation Delay (tPD)	Propagation Delay	30	-	60	ns
Skew (tSKEW)	Maximum Skew Between Channels	-	5	-	ns
Data Rate	Maximum Data Rate	-	-	150	Mbps
Output Current (IOL)	Output Low Current	-	-	4	mA
Output Current (IOH)	Output High Current	-	-	-4	mA
Operating Temperature (TA)	Ambient Operating Temperature	-40	-	125	掳C
Storage Temperature (TSTG)	Storage Temperature	-65	-	150	掳C

Instructions for Using ADUM1401BRWZ:

1. Power Supply:

   • Ensure that both VDD1 and VDD2 are within the specified range (3.0V to 5.5V).
   • Use appropriate decoupling capacitors (typically 0.1渭F and 10渭F) close to the power pins to minimize noise and ensure stable operation.

2. Signal Levels:

   • The input and output signals should be within the logic levels defined by the supply voltages (VDD1 and VDD2).
   • Ensure that the signal transitions are clean and within the specified data rate (up to 150 Mbps).

3. Isolation:

   • The ADUM1401BRWZ provides galvanic isolation up to 2500Vrms. Ensure that the isolation barrier is not exceeded to avoid damage.
   • Maintain proper clearance and creepage distances on the PCB to ensure reliable isolation.

4. Propagation Delay and Skew:

   • The propagation delay (tPD) is typically between 30ns and 60ns. This should be considered in timing-sensitive applications.
   • The maximum skew (tSKEW) between channels is 5ns, which is important for multi-channel synchronization.

5. Operating Temperature:

   • The device is rated to operate from -40掳C to 125掳C. Ensure that the ambient temperature does not exceed these limits.
   • For storage, the temperature range is -65掳C to 150掳C.

6. Handling:

   • The ADUM1401BRWZ is sensitive to electrostatic discharge (ESD). Use proper ESD protection when handling the device.
   • Follow recommended soldering and reflow profiles to avoid thermal damage during assembly.

7. Mounting:

   • Mount the device on a well-designed PCB with proper grounding and power distribution.
   • Ensure that the PCB layout minimizes crosstalk and electromagnetic interference (EMI).

8. Testing:

   • After assembly, test the device under typical operating conditions to verify functionality.
   • Use appropriate test equipment to measure propagation delay, skew, and other critical parameters.

By following these guidelines, you can ensure reliable and efficient operation of the ADUM1401BRWZ in your application.

(For reference only)