Details
BUY TD62002F https://www.utsource.net/itm/p/12610806.html
| Parameter | Symbol | Conditions | Min | Typical | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | Continuous | 1.8 | - | 5.5 | V |
| Output Current (Sink) | IOL | VOUT = 0.4V, Ta = 25掳C | 30 | - | - | mA |
| Output Current (Source) | IOH | VOUT = 3.0V, Ta = 25掳C | - | 5 | - | mA |
| Quiescent Current | IQ | Vcc = 5V, No Load, Ta = 25掳C | - | 10 | - | 渭A |
| Operating Temperature Range | Ta | - | -40 | - | 85 | 掳C |
| Storage Temperature Range | Tstg | - | -65 | - | 150 | 掳C |
| Thermal Resistance (胃ja) | - | - | - | 150 | - | 掳C/W |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage (Vcc) is within the range of 1.8V to 5.5V.
- Avoid exceeding the maximum voltage to prevent damage to the device.
Output Current:
- The device can sink up to 30mA and source up to 5mA at 25掳C.
- Ensure that the load current does not exceed these limits to avoid overheating or damage.
Quiescent Current:
- The quiescent current is typically 10渭A at 25掳C with no load.
- This value helps in power consumption calculations for low-power applications.
Operating Temperature:
- The device operates reliably between -40掳C and 85掳C.
- Ensure the ambient temperature remains within this range to maintain performance.
Storage Temperature:
- Store the device in an environment where the temperature ranges from -65掳C to 150掳C.
- Proper storage conditions help in maintaining the longevity and reliability of the device.
Thermal Management:
- The thermal resistance (胃ja) is 150掳C/W.
- Consider heat dissipation methods if the device will be used in high-power applications or in environments with poor heat dissipation.
Handling:
- Handle the device with care to avoid static discharge and physical damage.
- Use appropriate ESD protection measures when handling and soldering the device.
Mounting:
- Follow recommended soldering profiles and mounting guidelines to ensure proper attachment to the PCB.
- Avoid excessive heat during soldering to prevent damage to the device.
Testing:
- Test the device under specified conditions to verify its performance.
- Use appropriate test equipment and procedures to ensure accurate results.
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