25N120FL2

25N120FL2


Specifications
SKU
12610821
Details

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Parameter Symbol Min Typ Max Unit Notes
Drain-Source Voltage VDS - 1200 - V
Gate-Source Voltage VGS -20 - 20 V
Continuous Drain Current ID - 25 - A @ TC = 25掳C
Power Dissipation PTOT - - 360 W @ TC = 25掳C
Junction Temperature TJ - - 175 掳C
Storage Temperature TSTG -55 - 150 掳C
Thermal Resistance R胃JC - 0.8 - 掳C/W Junction to Case
Input Capacitance Ciss - 2400 - pF @ VDS = 600V, VGS = 15V, f = 1MHz
Output Capacitance Coss - 320 - pF @ VDS = 600V, VGS = 0V, f = 1MHz
Reverse Transfer Capacitance Crss - 120 - pF @ VDS = 600V, VGS = 0V, f = 1MHz
On-State Resistance RDS(on) - 0.75 - @ VGS = 15V, ID = 25A, TJ = 25掳C
Gate Charge QG - 190 - nC @ VDS = 600V, VGS = 15V, ID = 25A

Instructions for Use:

  1. Mounting and Handling:

    • Ensure that the device is mounted on a heatsink with adequate thermal paste to maintain the junction temperature within safe limits.
    • Handle the device with care to avoid damage to the pins and the die.
  2. Electrical Connections:

    • Connect the drain (D) to the high-voltage side of the circuit.
    • Connect the source (S) to the low-voltage side or ground.
    • Apply the gate (G) voltage carefully to control the switching of the MOSFET. Ensure that the gate voltage does not exceed the maximum ratings.
  3. Thermal Management:

    • Monitor the junction temperature to ensure it does not exceed 175掳C. Use a heatsink with sufficient thermal conductivity and surface area to dissipate heat effectively.
    • Consider forced air cooling or liquid cooling for high-power applications.
  4. Gate Drive:

    • Use a gate driver circuit to provide the necessary gate voltage and current. The gate drive should be capable of driving the gate charge quickly to minimize switching losses.
    • Ensure that the gate resistor is chosen to optimize switching speed while avoiding excessive ringing or oscillation.
  5. Protective Circuits:

    • Implement overvoltage protection to prevent damage from voltage spikes.
    • Use snubber circuits to suppress voltage transients during switching.
    • Consider adding a gate resistor to dampen any potential oscillations.
  6. Storage and Transportation:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Handle the device with ESD (Electrostatic Discharge) precautions to avoid damage from static electricity.
  7. Testing:

    • Test the device in a controlled environment to ensure it meets the specified parameters.
    • Use appropriate test equipment to measure the on-state resistance, gate charge, and other critical parameters.

By following these guidelines, you can ensure reliable and efficient operation of the 25N120FL2 MOSFET in your application.

(For reference only)

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