Details

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BUY T6A39 https://www.utsource.net/itm/p/12610834.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	Vcc	4.5	5.0	5.5	V
Output Current	Iout	-	200	-	mA	Continuous
Operating Temperature	Ta	-40	-	85	°C
Storage Temperature	Tstg	-65	-	150	°C
Quiescent Current	Iq	-	1.0	-	μA	Shutdown mode
Enable Input Voltage	Vin	0.8	-	1.2	V	Active high
Output Ripple	Vripple	-	30	-	mVp-p	At full load
Load Regulation	ΔVout	-	0.5	-	%	From 0 to 200mA
Line Regulation	ΔVout	-	0.1	-	%/V	Over 4.5V to 5.5V

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
   • Connect the Vcc pin to the power source and GND to ground.

2. Output Configuration:

   • The output current (Iout) can be up to 200mA continuously.
   • Connect the load between the output (OUT) pin and ground.

3. Enable Control:

   • The enable input (EN) is active high. Apply a voltage between 0.8V and 1.2V to turn the device on.
   • To disable the device, set the EN pin to a voltage below 0.8V or leave it floating.

4. Operating Temperature:

   • The device operates reliably within the temperature range of -40°C to 85°C.
   • Store the device in temperatures ranging from -65°C to 150°C.

5. Quiescent Current:

   • In shutdown mode, the quiescent current (Iq) is typically 1.0μA.

6. Output Ripple:

   • The output ripple voltage (Vripple) should not exceed 30mV peak-to-peak at full load.

7. Regulation:

   • The load regulation (ΔVout) is typically 0.5% from 0 to 200mA.
   • The line regulation (ΔVout) is typically 0.1% per volt over the input voltage range.

8. Capacitors:

   • Use appropriate decoupling capacitors (typically 100nF and 10μF) close to the Vcc and GND pins to ensure stable operation.
   • Place an output capacitor (typically 10μF) between the OUT pin and ground to filter the output ripple.

9. Layout Considerations:

   • Keep the PCB layout compact to minimize parasitic inductance and capacitance.
   • Use wide traces for power and ground connections to reduce resistance and improve heat dissipation.

10. Handling:

    • Handle the device with care to avoid static damage.
    • Follow ESD (Electrostatic Discharge) precautions during handling and installation.

(For reference only)