Details

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BUY SN75ALS181N https://www.utsource.net/itm/p/12610855.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	4.75	5.0	5.25	V
Input Voltage Range	VI	Low Level	-0.5	-	0.8	V
Input Voltage Range	VI	High Level	2.0	-	5.5	V
Output Voltage Range	VO	Low Level	-0.5	-	0.4	V
Output Voltage Range	VO	High Level	2.4	-	5.5	V
Propagation Delay Time	tpd	VCC = 5V, TA = 25掳C	20	-	35	ns
Power Dissipation	PD	Maximum	-	-	625	mW
Operating Temperature Range	TA	Commercial	0	-	70	掳C
Operating Temperature Range	TA	Industrial	-40	-	85	掳C
Storage Temperature Range	TSTG	-	-	-65	150	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 4.75V to 5.25V to avoid damage to the device.

2. Input Signals:

   • Input signals should be within the valid input voltage range. For low-level inputs, the voltage should not exceed 0.8V, and for high-level inputs, it should be at least 2.0V.

3. Output Signals:

   • The output voltage levels should be monitored to ensure they remain within the specified ranges. Low-level outputs should not exceed 0.4V, and high-level outputs should be at least 2.4V.

4. Propagation Delay:

   • The propagation delay time (t_pd) is crucial for timing considerations. At a supply voltage of 5V and ambient temperature of 25掳C, the typical delay is around 20-35 nanoseconds.

5. Power Dissipation:

   • The maximum power dissipation (P_D) should not exceed 625mW to prevent overheating and potential damage to the device.

6. Temperature Considerations:

   • The operating temperature range depends on the grade of the device. For commercial applications, it is 0掳C to 70掳C, and for industrial applications, it is -40掳C to 85掳C. The storage temperature range is -65掳C to 150掳C.

7. Handling and Storage:

   • Handle the device with care to avoid static discharge and physical damage. Store the device in a dry environment within the specified storage temperature range.

8. Soldering:

   • Follow recommended soldering profiles to avoid thermal stress that could damage the device. Ensure proper cooling after soldering to prevent thermal shock.

(For reference only)