Details

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BUY LOC111 https://www.utsource.net/itm/p/12610871.html

Parameter	Description	Value
Part Number	Unique identifier for the component	LOC111
Function	Primary function of the component	Low-dropout linear regulator
Input Voltage Range	Range of input voltages the component can handle	1.8V to 5.5V
Output Voltage Range	Range of output voltages the component can provide	0.8V to 5.0V
Dropout Voltage (Typical)	Voltage difference between input and output at which regulation is maintained	120mV at 150mA
Quiescent Current (Typical)	Current consumed by the device when active but not driving a load	60μA
Load Regulation	Change in output voltage with respect to change in load current	±0.1% (0mA to 150mA)
Line Regulation	Change in output voltage with respect to change in input voltage	±0.05% / V
Output Current (Maximum)	Maximum continuous output current the device can supply	150mA
Operating Temperature Range	Temperature range within which the device operates reliably	-40°C to +125°C
Storage Temperature Range	Temperature range within which the device can be stored without damage	-65°C to +150°C
Package Type	Physical package of the component	SOT-23-5
Pin Configuration	Pin layout of the component	IN, OUT, GND, EN, TRIM

Instructions for Use

1. Power Supply Connection:

   • Connect the input voltage to the IN pin.
   • Connect the output voltage to the OUT pin.
   • Ground the GND pin.

2. Enable Pin:

   • The EN pin is used to enable or disable the regulator. Apply a high signal (≥1.2V) to enable the regulator, and a low signal (≤0.4V) to disable it.

3. Output Voltage Adjustment:

   • The output voltage can be adjusted using the TRIM pin. Connect a resistor divider network between the OUT pin and the TRIM pin to set the desired output voltage.

4. Capacitors:

   • Place a 1μF ceramic capacitor between the IN pin and GND to stabilize the input voltage.
   • Place a 1μF ceramic capacitor between the OUT pin and GND to stabilize the output voltage.

5. Thermal Considerations:

   • Ensure adequate heat dissipation if the device is operating at high currents or in high ambient temperatures.

6. Storage and Handling:

   • Store the device in a dry, cool environment within the specified storage temperature range.
   • Handle the device with care to avoid static damage. Use proper ESD protection measures.

7. Soldering:

   • Follow recommended soldering profiles to avoid thermal stress on the component. Ensure that the soldering iron tip is clean and well-tinned.

8. Testing:

   • After assembly, test the device under various conditions to ensure it meets the specified performance parameters.

(For reference only)