Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Continuous Drain Current | ID | - | 60 | - | A | Continuous drain current at 25掳C |
| Peak Pulse Drain Current | IP | - | 180 | - | A | Peak pulse drain current (t < 10 ms) |
| Gate-Source Voltage | VGS(th) | 0.9 | 1.7 | 2.5 | V | Gate-source threshold voltage |
| Drain-Source Breakdown | BVdss | 30 | - | - | V | Drain-source breakdown voltage |
| On-State Resistance | RDS(on) | - | 2.2 | - | m惟 | On-state resistance at VGS = 4.5V, ID = 60A |
| Gate Charge | Qg | - | 130 | - | nC | Total gate charge |
| Input Capacitance | Ciss | - | 1700 | - | pF | Input capacitance |
| Output Capacitance | Coss | - | 450 | - | pF | Output capacitance |
| Reverse Transfer Capacitance | Crss | - | 1250 | - | pF | Reverse transfer capacitance |
| Power Dissipation | Ptot | - | - | 220 | W | Total power dissipation |
| Junction Temperature | Tj | -25 | - | 150 | 掳C | Operating junction temperature range |
| Storage Temperature | Tstg | -40 | - | 150 | 掳C | Storage temperature range |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to maintain the junction temperature within the specified limits.
- Use recommended PCB layout guidelines to minimize parasitic inductances.
Power Supply:
- Apply a gate-source voltage (VGS) within the specified range to ensure reliable operation.
- Ensure the drain-source voltage (VDS) does not exceed the maximum breakdown voltage (BVdss).
Current Handling:
- Do not exceed the continuous drain current (ID) or peak pulse drain current (IP) ratings.
- Use external current limiting if necessary to protect the device from overcurrent conditions.
Thermal Management:
- Monitor the junction temperature (Tj) to avoid thermal runaway.
- Use thermal simulation tools to optimize the thermal design.
Storage and Handling:
- Store the device in a dry environment to prevent moisture damage.
- Handle with care to avoid mechanical stress and electrostatic discharge (ESD).
Testing:
- Perform initial testing under controlled conditions to verify the device parameters.
- Regularly check the device performance during operation to ensure reliability.
Safety:
- Follow all safety guidelines and regulations when handling high-power electronic components.
- Use appropriate protective equipment to avoid injury.
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