BA6822F

BA6822F


Specifications
SKU
12610901
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage Vcc Operating 4.5 - 5.5 V
Quiescent Current Iq Vcc = 5V - 10 - 渭A
Output Current Iout Continuous - 100 150 mA
Peak Output Current Ipeak Pulse - 300 - mA
Output Voltage Swing Vos Load = 1k惟 0.5 - 4.0 V
Slew Rate SR Vcc = 5V - 1.0 - V/渭s
Power Dissipation Pd Ta = 25掳C - 625 - mW
Operating Temperature Topr -40 - 85 掳C
Storage Temperature Tstg -55 - 150 掳C

Instructions for Use

  1. Supply Voltage (Vcc):

    • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Quiescent Current (Iq):

    • The quiescent current is typically 10 渭A at a supply voltage of 5V. This should be considered when designing power-efficient circuits.
  3. Output Current (Iout):

    • The device can provide a continuous output current of up to 150 mA. For optimal performance, keep the load current within this range.
  4. Peak Output Current (Ipeak):

    • The peak output current can reach up to 300 mA in pulse conditions. Ensure that the load does not exceed this limit for extended periods to prevent overheating.
  5. Output Voltage Swing (Vos):

    • The output voltage swing is from 0.5V to 4.0V with a load of 1k惟. This should be considered when designing the load circuit to ensure proper signal levels.
  6. Slew Rate (SR):

    • The slew rate is 1.0 V/渭s at a supply voltage of 5V. This parameter is important for applications requiring fast signal transitions.
  7. Power Dissipation (Pd):

    • The maximum power dissipation is 625 mW at an ambient temperature of 25掳C. Proper heat sinking or cooling may be required for high-power applications.
  8. Operating Temperature (Topr):

    • The operating temperature range is from -40掳C to 85掳C. Ensure the device is used within this range to maintain reliability and performance.
  9. Storage Temperature (Tstg):

    • The storage temperature range is from -55掳C to 150掳C. Store the device in a dry, cool place to prevent damage.
  10. Handling:

    • Handle the device with care to avoid static discharge and physical damage. Use appropriate ESD protection measures during handling and installation.
(For reference only)

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