Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -600 | - | - | V | - |
| Gate-Source Voltage | VGS | -20 | - | 20 | V | - |
| Continuous Drain Current | ID | - | 27 | - | A | TC = 25掳C |
| Pulse Drain Current | IDpeak | - | 138 | - | A | tp = 10 渭s, IG = 10 A, TC = 25掳C |
| Power Dissipation | PTOT | - | 240 | - | W | TC = 25掳C |
| Junction Temperature | TJ | - | - | 175 | 掳C | - |
| Storage Temperature Range | TSTG | -65 | - | 150 | 掳C | - |
| Total Gate Charge | QG | - | 130 | - | nC | - |
| Input Capacitance | Ciss | - | 1900 | - | pF | VDS = 25 V, f = 1 MHz |
| Output Capacitance | Coss | - | 230 | - | pF | VDS = 25 V, f = 1 MHz |
| Reverse Transfer Capacitance | Crss | - | 230 | - | pF | VDS = 25 V, f = 1 MHz |
| On-State Resistance | RDS(on) | - | 0.18 | - | 惟 | VGS = 10 V, ID = 27 A, TC = 25掳C |
| Threshold Voltage | VGS(th) | 2.0 | 4.0 | 6.0 | V | ID = 250 渭A |
| Gate-Source Leakage Current | IGSS | - | - | 卤100 | nA | VGS = 卤20 V, TA = 25掳C |
| Drain Leakage Current | IDSS | - | - | 100 | 渭A | VDS = 600 V, TA = 25掳C |
Instructions for Use:
Handling Precautions:
- Avoid exceeding the maximum ratings specified in the table.
- Use proper ESD (Electrostatic Discharge) protection when handling the device to prevent damage.
Mounting:
- Ensure good thermal management to keep the junction temperature within the specified limits.
- Use a heatsink if necessary to dissipate heat effectively.
Biasing:
- Apply the gate-source voltage (VGS) within the recommended range to ensure reliable operation.
- Ensure the gate drive circuitry can provide sufficient current to charge and discharge the gate capacitance quickly.
Operation:
- Operate the device within the safe operating area (SOA) to avoid thermal runaway and potential damage.
- Monitor the drain current (ID) and power dissipation (PTOT) to ensure they do not exceed the rated values.
Storage:
- Store the device in a dry, cool environment within the specified storage temperature range.
- Protect the device from moisture and physical damage during storage and transportation.
Testing:
- Perform initial testing at room temperature to verify the device parameters.
- Gradually increase the load and environmental conditions to ensure stable performance under all operating conditions.
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