IRFP27N60K

IRFP27N60K


Specifications
SKU
12610930
Details

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Parameter Symbol Min Typ Max Unit Conditions
Drain-Source Voltage VDS -600 - - V -
Gate-Source Voltage VGS -20 - 20 V -
Continuous Drain Current ID - 27 - A TC = 25掳C
Pulse Drain Current IDpeak - 138 - A tp = 10 渭s, IG = 10 A, TC = 25掳C
Power Dissipation PTOT - 240 - W TC = 25掳C
Junction Temperature TJ - - 175 掳C -
Storage Temperature Range TSTG -65 - 150 掳C -
Total Gate Charge QG - 130 - nC -
Input Capacitance Ciss - 1900 - pF VDS = 25 V, f = 1 MHz
Output Capacitance Coss - 230 - pF VDS = 25 V, f = 1 MHz
Reverse Transfer Capacitance Crss - 230 - pF VDS = 25 V, f = 1 MHz
On-State Resistance RDS(on) - 0.18 - VGS = 10 V, ID = 27 A, TC = 25掳C
Threshold Voltage VGS(th) 2.0 4.0 6.0 V ID = 250 渭A
Gate-Source Leakage Current IGSS - - 卤100 nA VGS = 卤20 V, TA = 25掳C
Drain Leakage Current IDSS - - 100 渭A VDS = 600 V, TA = 25掳C

Instructions for Use:

  1. Handling Precautions:

    • Avoid exceeding the maximum ratings specified in the table.
    • Use proper ESD (Electrostatic Discharge) protection when handling the device to prevent damage.
  2. Mounting:

    • Ensure good thermal management to keep the junction temperature within the specified limits.
    • Use a heatsink if necessary to dissipate heat effectively.
  3. Biasing:

    • Apply the gate-source voltage (VGS) within the recommended range to ensure reliable operation.
    • Ensure the gate drive circuitry can provide sufficient current to charge and discharge the gate capacitance quickly.
  4. Operation:

    • Operate the device within the safe operating area (SOA) to avoid thermal runaway and potential damage.
    • Monitor the drain current (ID) and power dissipation (PTOT) to ensure they do not exceed the rated values.
  5. Storage:

    • Store the device in a dry, cool environment within the specified storage temperature range.
    • Protect the device from moisture and physical damage during storage and transportation.
  6. Testing:

    • Perform initial testing at room temperature to verify the device parameters.
    • Gradually increase the load and environmental conditions to ensure stable performance under all operating conditions.
(For reference only)

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