Details

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Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VCC	4.5	-	18	V	-
Quiescent Supply Current	ICC	-	200	-	渭A	VCC = 5V, No Load
Input High Voltage	VIH	2.0	-	VCC	V	-
Input Low Voltage	VIL	-	-	0.8	V	-
Output High Voltage	VOH	-	VCC - 0.3	VCC - 0.1	V	IO = 10 mA
Output Low Voltage	VOL	0.1	-	0.3	V	IO = 10 mA
Output Current (Sink)	IOL	-	-	100	mA	VOL = 0.4V
Output Current (Source)	IOH	-	-	100	mA	VOH = VCC - 0.4V
Propagation Delay Time (Low to High)	tPLH	-	15	-	ns	VCC = 5V, CL = 15 pF
Propagation Delay Time (High to Low)	tPHL	-	15	-	ns	VCC = 5V, CL = 15 pF
Maximum Operating Frequency	fMAX	-	10	-	MHz	VCC = 5V, CL = 15 pF
Storage Temperature Range	TSTG	-65	-	150	掳C	-
Operating Temperature Range	TA	-40	-	85	掳C	-

Instructions for Use:

1. Power Supply:

   • The device operates with a supply voltage range of 4.5V to 18V. Ensure the power supply is stable and within this range to avoid damage or malfunction.

2. Input Levels:

   • For proper operation, ensure that the input high voltage (V_IH) is at least 2.0V and can go up to the supply voltage (V_CC).
   • The input low voltage (V_IL) should be no more than 0.8V.

3. Output Levels:

   • The output high voltage (V_OH) will be close to the supply voltage (V_CC) when the output is high.
   • The output low voltage (V_OL) will be close to 0V when the output is low.

4. Output Current:

   • The device can sink or source up to 100mA. Ensure that the load connected to the output does not exceed this current limit.

5. Propagation Delay:

   • The typical propagation delay time for both low-to-high and high-to-low transitions is 15ns when the supply voltage is 5V and the load capacitance is 15pF.

6. Operating Frequency:

   • The maximum operating frequency is 10MHz under typical conditions (V_CC = 5V, CL = 15pF).

7. Temperature Considerations:

   • The device can operate over a temperature range of -40掳C to 85掳C. Store the device in a temperature range of -65掳C to 150掳C.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits. Use appropriate ESD protection measures during handling and installation.

9. Mounting:

   • Ensure proper mounting and soldering techniques to avoid thermal and mechanical stress on the device. Follow the recommended PCB layout guidelines for optimal performance.

10. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications and performance criteria.

(For reference only)