MRFE6VP61K25GNR6

MRFE6VP61K25GNR6


Specifications
Details

BUY MRFE6VP61K25GNR6 https://www.utsource.net/itm/p/12611049.html

Parameter Value Unit
Device MRFE6VP61K25GNR6
Type RF Power MOSFET
Package TO-247-3L
Max Drain-Source Voltage (VDS) 60 V
Max Gate-Source Voltage (VGS) ±20 V
Continuous Drain Current (ID) 61 A
Pulse Drain Current (IDM) 250 A
RDS(on) at VGS=10V 8.5
Power Dissipation (PD) 220 W
Junction Temperature (TJ) -55 to +175 °C
Storage Temperature (TSTG) -55 to +150 °C

Instructions:

  1. Installation: Ensure the device is mounted on a suitable heatsink to manage heat dissipation, especially when operating near maximum power levels.
  2. Handling Precautions: Use proper ESD (Electrostatic Discharge) protection measures while handling the device to prevent damage.
  3. Biasing Conditions: Operate within specified gate-source voltage limits to avoid damaging the gate oxide.
  4. Current Limitation: Do not exceed the continuous or pulse drain current ratings to prevent thermal runaway and potential device failure.
  5. Temperature Monitoring: Regularly monitor the junction temperature to ensure it remains within operational limits.
  6. Application Notes: Refer to the manufacturer’s application notes for detailed guidelines on using this device in various circuit configurations.
(For reference only)

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