Details

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BUY GAL22V10D-10LJ https://www.utsource.net/itm/p/12611051.html

Parameter	Description	Value
Device Type	Programmable Logic Device (PLD)	-
Package	Plastic Leaded Chip Carrier (PLCC)	20-Pin
Operating Voltage (Vcc)	Supply Voltage Range	4.5V to 5.5V
Maximum Power Dissipation	-	630mW
Propagation Delay Time (typ)	tpd	8ns at Vcc = 5V, TA = 25掳C
Output Drive Capability	IOL (min), IOH (min)	24mA, -24mA
Operating Temperature Range	TJ ( Junction Temperature )	-40掳C to +85掳C
Storage Temperature Range	Tstg	-65掳C to +150掳C
Input Voltage High (VIH)	-	2.0V to Vcc
Input Voltage Low (VIL)	-	0V to 0.8V
Input Leakage Current (IIH, IIL)	-	卤1渭A
Output Leakage Current (IOL, IOH)	-	卤50渭A
Programming Voltage (VPP)	-	12.6V 卤 0.6V
Programming Current (IPP)	-	50mA max
Erase Time (typ)	-	10s at 25掳C
Write Time (typ)	-	1ms at 25掳C
Number of Macrocells	-	10
Internal Capacitance (Cint)	-	10pF typ
External Pin Capacitance (Cext)	-	20pF typ

Instructions for GAL22V10D-10LJ

1. Power Supply:

   • Connect Vcc to a stable 5V supply.
   • Ground all GND pins.

2. Programming:

   • Use a compatible programmer to program the device.
   • Apply the programming voltage (VPP) of 12.6V 卤 0.6V to the appropriate pin.
   • Ensure the programming current (IPP) does not exceed 50mA.

3. Erase:

   • The device can be erased using ultraviolet (UV) light.
   • Place the device under a UV eraser for approximately 10 seconds at 25掳C.

4. Write:

   • After erasing, use the programmer to write the desired logic configuration.
   • The typical write time is 1ms at 25掳C.

5. Input/Output Handling:

   • Ensure input voltages do not exceed the specified VIH and VIL levels.
   • Do not exceed the maximum output drive capability (24mA, -24mA).

6. Temperature Considerations:

   • Operate the device within the specified temperature range (-40掳C to +85掳C).
   • Store the device within the storage temperature range (-65掳C to +150掳C).

7. Handling Precautions:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Use proper anti-static equipment and procedures.

8. Mounting:

   • Ensure proper alignment of the device during mounting.
   • Follow recommended soldering profiles to avoid thermal stress.

9. Testing:

   • After programming and mounting, test the device to ensure it meets the required specifications and functionality.

(For reference only)