Details
BUY IRF1010E. https://www.utsource.net/itm/p/12611115.html
| Parameter | Symbol | Min | Typical | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | V(DS) | - | 55 | V | ||
| Gate-Source Voltage | V(GS) | - | ±20 | V | ||
| Continuous Drain Current | I(D) | - | 36 | A | Tc = 25°C | |
| Pulse Drain Current | I(D pul) | - | 110 | A | Tp = 10 μs, Duty Cycle ≤ 1% | |
| Power Dissipation | P(TOT) | - | 97 | W | Tc = 25°C | |
| Junction Temperature | T(J) | - | 150 | °C | ||
| Storage Temperature | T(STG) | -55 | 150 | °C | ||
| Thermal Resistance | R(θJC) | - | 0.48 | °C/W | Case to junction |
Instructions for Use:
- Handling Precautions: The IRF1010E is sensitive to electrostatic discharge (ESD). Use appropriate ESD precautions when handling.
- Mounting: Ensure proper heat sinking for reliable operation at higher currents and temperatures. The thermal resistance should be considered in the design.
- Gate Drive: Apply gate voltage within the specified limits to avoid damage. For optimal performance, use a fast rise and fall time for gate signals.
- Operating Limits: Do not exceed the maximum ratings provided in the table. Continuous operation at the maximum ratings can reduce component life.
- Pulse Operation: When operating in pulse mode, ensure that the duty cycle and pulse width are within the specified limits to prevent overheating.
- Storage and Operating Temperature: Store and operate the device within the temperature range specified to ensure reliability and longevity.
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