IRF7478PBF

IRF7478PBF


Specifications
Details

BUY IRF7478PBF https://www.utsource.net/itm/p/12611120.html

Parameter Symbol Min Typ Max Unit Conditions
Drain-Source On-Resistance Rds(on) - 12 - Vgs = 10V, Id = 3.5A, Ta = 25°C
Gate Threshold Voltage Vgs(th) 1.0 - 2.0 V Id = 250μA, Ta = 25°C
Continuous Drain Current Id - - 3.5 A Tc = 25°C
Pulse Drain Current Idm - - 17 A Pulse width ≤ 300μs, Duty cycle ≤ 2%
Total Power Dissipation Ptot - - 0.8 W Ta = 25°C
Junction Temperature Tj - - 150 °C -
Storage Temperature Tstg -55 - 150 °C -

Instructions for Use:

  1. Handling Precautions: The IRF7478PBF is sensitive to electrostatic discharge (ESD). Handle with care and use proper ESD protection measures.
  2. Mounting: Ensure good thermal contact with the heat sink if operating at high power levels or in high ambient temperatures.
  3. Biasing: Apply gate-source voltage within specified limits to avoid damage. Ensure that the gate drive circuitry can provide sufficient current to charge and discharge the gate capacitance quickly.
  4. Operating Conditions: Do not exceed the maximum ratings listed in the table. Pay particular attention to the junction temperature and power dissipation limits.
  5. Storage: Store in a dry environment and observe the storage temperature range to prevent damage.
  6. Testing: When testing the device, ensure that all parameters are within the specified limits to avoid misleading results.
(For reference only)

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