Details
BUY IRF7478PBF https://www.utsource.net/itm/p/12611120.html
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source On-Resistance | Rds(on) | - | 12 | - | mΩ | Vgs = 10V, Id = 3.5A, Ta = 25°C |
| Gate Threshold Voltage | Vgs(th) | 1.0 | - | 2.0 | V | Id = 250μA, Ta = 25°C |
| Continuous Drain Current | Id | - | - | 3.5 | A | Tc = 25°C |
| Pulse Drain Current | Idm | - | - | 17 | A | Pulse width ≤ 300μs, Duty cycle ≤ 2% |
| Total Power Dissipation | Ptot | - | - | 0.8 | W | Ta = 25°C |
| Junction Temperature | Tj | - | - | 150 | °C | - |
| Storage Temperature | Tstg | -55 | - | 150 | °C | - |
Instructions for Use:
- Handling Precautions: The IRF7478PBF is sensitive to electrostatic discharge (ESD). Handle with care and use proper ESD protection measures.
- Mounting: Ensure good thermal contact with the heat sink if operating at high power levels or in high ambient temperatures.
- Biasing: Apply gate-source voltage within specified limits to avoid damage. Ensure that the gate drive circuitry can provide sufficient current to charge and discharge the gate capacitance quickly.
- Operating Conditions: Do not exceed the maximum ratings listed in the table. Pay particular attention to the junction temperature and power dissipation limits.
- Storage: Store in a dry environment and observe the storage temperature range to prevent damage.
- Testing: When testing the device, ensure that all parameters are within the specified limits to avoid misleading results.
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