Details
BUY 2SK246BL https://www.utsource.net/itm/p/12611155.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain Voltage | VDS | - | 500 | - | V | Maximum drain-to-source voltage |
| Gate Voltage | VGS | - | 20 | - | V | Maximum gate-to-source voltage |
| Continuous Drain | ID | - | 4 | - | A | Continuous drain current |
| Pulse Drain | IDP | - | 8 | - | A | Peak pulse drain current (t=10ms) |
| Power Dissipation | PD | - | 60 | - | W | Maximum power dissipation |
| Junction Temp | Tj | - | 150 | - | °C | Maximum junction temperature |
Instructions for Use:
- Mounting: Ensure the device is mounted on a suitable heatsink to manage heat dissipation, especially under high-power conditions.
- Biasing: Apply gate voltage within the specified limits to avoid damage. The typical operating range should be well below the maximum ratings.
- Current Handling: Do not exceed the continuous or pulse drain current ratings. For pulses longer than 10ms, derate the current according to the datasheet guidelines.
- Temperature Monitoring: Keep the junction temperature within the specified limit to ensure reliable operation. Consider ambient temperature and cooling methods.
- Storage Conditions: Store in a dry environment and handle with care to prevent electrostatic discharge (ESD) damage. Use appropriate ESD protection measures during handling.
- Application Notes: Refer to the manufacturer’s application notes for detailed guidance on circuit design and optimization.
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