Details

---

BUY LA5602 https://www.utsource.net/itm/p/12611159.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	Vcc	4.5	5	5.5	V	Operating voltage range
Output Current	Iout	-	100	150	mA	Maximum continuous output current
Quiescent Current	Iq	-	1	3	mA	Current consumed by the device when idle
Output Voltage	Vout	-	3.3	5	V	Regulated output voltage range
Dropout Voltage	Vdo	-	0.2	0.5	V	Voltage difference between input and output
Load Regulation	-	-	0.5	1	%	Change in output voltage with load
Line Regulation	-	-	0.1	0.5	%	Change in output voltage with input voltage
Ripple Rejection	-	50	70	80	dB	Ability to reject input ripple
Operating Temperature	Ta	-40	-	85	掳C	Ambient temperature range
Storage Temperature	Tstg	-65	-	150	掳C	Temperature range for storage

Instructions for Using LA5602

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
   • Connect the Vcc pin to the positive terminal of the power supply and the GND pin to the negative terminal.

2. Output Configuration:

   • The output voltage (Vout) is typically 3.3V or 5V, depending on the specific model. Verify the output voltage using a multimeter before connecting any load.
   • Connect the load to the Vout pin and ensure the current drawn does not exceed the maximum output current of 150mA.

3. Quiescent Current:

   • The quiescent current (Iq) is typically around 1mA. This is the current consumed by the device when no load is connected.

4. Thermal Management:

   • Ensure adequate heat dissipation if operating at high currents or in high ambient temperatures. The operating temperature range is -40掳C to 85掳C.

5. Ripple Rejection:

   • The device has a ripple rejection of 50dB to 80dB, which helps in filtering out input voltage ripples. Use appropriate capacitors on the input and output to further reduce ripple.

6. Storage:

   • Store the device in a dry environment within the storage temperature range of -65掳C to 150掳C.

7. Capacitors:

   • For stable operation, use a 1渭F ceramic capacitor between Vcc and GND, and a 10渭F electrolytic capacitor between Vout and GND. Place these capacitors as close as possible to the device.

8. PCB Layout:

   • Ensure a clean and well-designed PCB layout to minimize noise and improve performance. Keep the ground plane solid and wide to reduce resistance and inductance.

9. Testing:

   • After assembly, test the device under various conditions to ensure it meets the specified parameters and operates correctly.

(For reference only)