MC33063

MC33063


Specifications
SKU
12611171
Details

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Parameter Symbol Min Typ Max Unit Notes
Input Voltage VIN 2.7 - 40 V
Output Voltage VOUT - - 40 V Adjustable
Switching Frequency fSW - 100 - kHz
Output Current (Continuous) IOUT - 1.5 - A
Quiescent Current IQ - 1 - mA
Shutdown Current ISD - 0.1 - 渭A
Thermal Shutdown TSD - 160 - 掳C
Storage Temperature TSTG -40 - 150 掳C
Operating Junction Temperature TJ -40 - 150 掳C

Instructions for Using the MC33063:

  1. Input Voltage (VIN):

    • The input voltage range is from 2.7V to 40V. Ensure the input voltage is within this range to avoid damage to the device.
  2. Output Voltage (VOUT):

    • The output voltage can be adjusted using external components. The typical configuration involves a feedback resistor network to set the desired output voltage.
  3. Switching Frequency (fSW):

    • The switching frequency is typically 100kHz. This can be adjusted by changing the value of the timing capacitor (CT).
  4. Output Current (IOUT):

    • The maximum continuous output current is 1.5A. Ensure that the load does not exceed this limit to prevent overheating and potential damage.
  5. Quiescent Current (IQ):

    • The quiescent current is typically 1mA. This is the current consumed by the IC when it is active but not driving any load.
  6. Shutdown Current (ISD):

    • When the shutdown pin is activated, the IC consumes only 0.1渭A. This feature is useful for power-saving applications.
  7. Thermal Shutdown (TSD):

    • The IC will shut down if the junction temperature exceeds 160掳C to prevent thermal damage. Ensure proper heat dissipation for reliable operation.
  8. Storage Temperature (TSTG):

    • The IC can be stored in temperatures ranging from -40掳C to 150掳C. However, ensure it is operated within the operating junction temperature range during use.
  9. Operating Junction Temperature (TJ):

    • The operating junction temperature range is from -40掳C to 150掳C. Ensure the device is used within this range to maintain reliability and performance.

Additional Considerations:

  • PCB Layout: Proper PCB layout is crucial for thermal management and noise reduction. Keep the power traces short and wide, and use ground planes to reduce noise.
  • Component Selection: Choose high-quality external components, especially for the inductor and capacitors, to ensure stable and efficient operation.
  • Protection Circuits: Implement appropriate protection circuits, such as overvoltage and overcurrent protection, to safeguard the IC and connected components.
(For reference only)

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