Details
BUY SN74HC378N. https://www.utsource.net/itm/p/12611175.html
| Parameter | Symbol | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Supply Voltage | VCC | 2.0 | - | 6.0 | V |
| Input Low Voltage | VIL | - | - | 1.5 | V |
| Input High Voltage | VIH | 3.5 | - | - | V |
| Output Low Voltage (IOL = 4 mA) | VOL | - | - | 0.4 | V |
| Output High Voltage (IOH = -4 mA) | VOH | 2.4 | - | - | V |
| Propagation Delay Time | tpd | - | 13 | 30 | ns |
| Power Dissipation | PD | - | - | 100 | mW |
| Operating Temperature Range | TA | -40 | - | 85 | 掳C |
| Storage Temperature Range | TSTG | -65 | - | 150 | 掳C |
Instructions for SN74HC378N
Supply Voltage (VCC):
- Ensure the supply voltage is within the range of 2.0V to 6.0V. Operating outside this range can damage the device.
Input Levels:
- For a valid low input, the voltage should be less than or equal to 1.5V.
- For a valid high input, the voltage should be greater than or equal to 3.5V.
Output Levels:
- When the output is low, the voltage will not exceed 0.4V when sourcing 4 mA.
- When the output is high, the voltage will be at least 2.4V when sinking -4 mA.
Propagation Delay (tpd):
- The typical propagation delay time is 13 ns, with a maximum of 30 ns. This is crucial for timing considerations in your circuit.
Power Dissipation (PD):
- The maximum power dissipation is 100 mW. Ensure adequate heat dissipation if operating near this limit.
Operating Temperature (TA):
- The device is designed to operate within a temperature range of -40掳C to 85掳C. Avoid exposing the device to temperatures outside this range during operation.
Storage Temperature (TSTG):
- Store the device in an environment where the temperature ranges from -65掳C to 150掳C.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal circuits. Use proper ESD protection practices.
Pin Configuration:
- Refer to the datasheet for the specific pin configuration and functions. Proper pin connections are essential for correct operation.
Testing:
- Before integrating the device into a larger system, test it individually to ensure it meets the specified parameters and functions correctly.
For detailed information and specific applications, refer to the full datasheet provided by the manufacturer.
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