Details
BUY SQM120P10-10M1L https://www.utsource.net/itm/p/12611203.html
| Parameter | Description |
|---|---|
| Part Number | SQM120P10-10M1L |
| Type | Surface Mount Device (SMD) |
| Package Type | MLP (Modified Leadframe Package) |
| Dimensions | 3.0 x 3.0 x 1.0 mm |
| Mounting Type | Surface Mount |
| **Operating Temperature | -40掳C to +125掳C |
| Storage Temperature | -65掳C to +150掳C |
| Lead Finish | Matte Tin |
| Body Material | Ceramic Composite |
| Compliance | RoHS, REACH |
Instructions for Use:
- Handling: Handle with care to avoid damage to the component leads and body.
- Mounting: Ensure proper alignment during mounting on the PCB. Apply solder paste evenly on the pads.
- Reflow Soldering Profile: Follow a standard reflow soldering profile suitable for lead-free components. Peak temperature should be between 230掳C to 260掳C.
- Inspection: After soldering, inspect for any defects such as bridging, insufficient solder, or misalignment.
- Storage: Store in a dry place, away from direct sunlight and extreme temperatures. Use within 6 months of opening the packaging.
- Environmental Considerations: Dispose of any unused components responsibly, adhering to local environmental regulations.
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