Details
BUY TD62103P https://www.utsource.net/itm/p/12611228.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | - | 4.5 | - | 18 | V |
| Output Current (Continuous) | IO(CONT) | VCE = 5V, TA = 25掳C | - | 500 | - | mA |
| Output Current (Peak) | IO(PEAK) | VCE = 5V, TA = 25掳C | - | 1000 | - | mA |
| Power Dissipation | PD | TA = 25掳C | - | - | 1500 | mW |
| Operating Temperature Range | TA | - | -40 | - | 85 | 掳C |
| Storage Temperature Range | TSTG | - | -55 | - | 150 | 掳C |
| Junction Temperature | TJ | - | - | - | 150 | 掳C |
Instructions for Use:
- Supply Voltage: Ensure the supply voltage is within the range of 4.5V to 18V to avoid damage to the device.
- Output Current: The continuous output current should not exceed 500mA, while peak currents up to 1000mA are permissible but should be kept brief to prevent overheating.
- Power Dissipation: The power dissipation should not exceed 1500mW to ensure reliable operation and prevent thermal runaway.
- Operating Temperature: The device is designed to operate reliably between -40掳C and 85掳C. Avoid exposing the device to temperatures outside this range during operation.
- Storage Temperature: Store the device in environments where the temperature ranges from -55掳C to 150掳C to maintain its integrity.
- Junction Temperature: The maximum junction temperature should not exceed 150掳C. Proper heat sinking may be required for high-power applications to keep the junction temperature within safe limits.
- Mounting and Handling: Handle the device with care to avoid mechanical stress. Follow proper soldering techniques to prevent thermal shock.
- Electrostatic Discharge (ESD) Protection: Use appropriate ESD protection measures when handling the device to prevent damage from static electricity.
- Circuit Design: Ensure that the circuit design includes adequate decoupling capacitors and transient protection to safeguard the device from voltage spikes and other electrical transients.
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