J108

J108


Specifications
Details

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Parameter Description Value
Part Number Identifies the specific product J108
Type Type of component Junction FET
Material Semiconductor material used Silicon
Configuration Device configuration N-channel
V(br)do Drain-to-source breakdown voltage 50V
Idss Zero gate voltage drain current 1mA
Input Capacitance Gate-to-source capacitance at zero bias 12pF
Power Dissipation Maximum power dissipation 375mW
Operating Temperature Range of operating temperatures -65掳C to 150掳C
Package Type Enclosure type TO-92

Instructions for Use:

  1. Handling Precautions: The J108 is sensitive to electrostatic discharge (ESD). Handle with care and use appropriate ESD protection measures.
  2. Mounting: Ensure that the device is mounted correctly according to the pin configuration provided in the datasheet. Avoid excessive heat during soldering to prevent damage.
  3. Biasing: For optimal performance, ensure the gate voltage is set within specified limits to avoid exceeding the maximum ratings.
  4. Thermal Considerations: Keep the junction temperature within the operational range by providing adequate heat sinking if necessary.
  5. Testing: When testing or measuring the device, refer to the recommended test circuits and conditions outlined in the datasheet to ensure accurate readings.
(For reference only)

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