Details

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BUY K4S560832N-LC75 https://www.utsource.net/itm/p/12611327.html

Parameter	Description	Value
Product Name	K4S560832N-LC75
Type	SDRAM
Capacity	64 Mbit (8M x 8)
Organization	8M x 8
Voltage Supply	VDD, VDDQ	3.3V 卤 0.3V
Operating Temperature	Commercial (-20掳C to +85掳C), Industrial (-40掳C to +85掳C)
Access Time	CL=2, tRCD=2, tRP=2, tRAS=5
Cycle Time	10ns
Refresh Rate	8K refresh cycles per 64ms
Package Type	TSOP II (46-pin)
Features	Auto-Refresh, Self-Refresh, DLL Enable/Disable

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VDD and VDDQ) is set to 3.3V 卤 0.3V.

2. Temperature Considerations:

   • Operate within the specified temperature range depending on the grade selected (Commercial or Industrial).

3. Timing Parameters:

   • Set the access times according to the specified values: CAS Latency (CL)=2, RAS to CAS Delay (tRCD)=2, Row Precharge Time (tRP)=2, Active to Precharge Delay (tRAS)=5.
   • Ensure cycle time does not exceed 10ns.

4. Refresh Operations:

   • Implement a refresh rate of 8K refresh cycles every 64ms to maintain data integrity.

5. Special Features:

   • Utilize the Auto-Refresh and Self-Refresh modes for power management.
   • The DLL (Delay Locked Loop) can be enabled or disabled as required by the application.

6. Package Handling:

   • Handle the TSOP II package with care to avoid damage to pins and ensure proper seating in the socket.

7. Installation:

   • Follow standard installation procedures for surface mount devices, ensuring correct orientation and secure mounting.

8. Testing:

   • After installation, verify all connections and perform functional tests to ensure the device operates correctly within the system.

(For reference only)