Details

---

BUY CDC303 https://www.utsource.net/itm/p/12611338.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VDD)	Operating voltage range	1.65	-	5.5	V
Input Voltage Range	Range for input signals	0	-	VDD	V
Output Voltage Range	Range for output signals	0	-	VDD	V
Channel-to-Channel Isolation	Isolation between channels	-	70	-	dB
Common Mode Rejection Ratio (CMRR)	Ability to reject common mode signals	-	80	-	dB
Power Consumption	Typical power consumption per channel	-	25	-	渭A
Propagation Delay	Time delay from input to output	-	10	-	ns
Operating Temperature	Range for reliable operation	-40	-	125	掳C
Storage Temperature	Range for storage without damage	-65	-	150	掳C

Instructions:

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the specified range of 1.65V to 5.5V.
   • Connect the ground (GND) to a stable reference point.

2. Signal Input:

   • Apply input signals within the range of 0V to VDD.
   • Ensure that the input signals do not exceed the supply voltage to avoid damage.

3. Signal Output:

   • The output signals will be within the range of 0V to VDD.
   • Use appropriate load resistors if necessary to match the output impedance.

4. Isolation:

   • Channels are isolated with a minimum of 70dB channel-to-channel isolation to prevent crosstalk.

5. Common Mode Rejection:

   • The device has a typical CMRR of 80dB, effectively rejecting common mode signals.

6. Power Consumption:

   • Each channel typically consumes 25渭A. Consider this when designing your power budget.

7. Propagation Delay:

   • The typical propagation delay is 10ns. Account for this delay in your timing calculations.

8. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to 125掳C for reliable performance.
   • Store the device in temperatures ranging from -65掳C to 150掳C to prevent damage.

9. Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Follow ESD (Electrostatic Discharge) precautions during handling and installation.

10. Mounting:

    • Solder the device to the PCB using recommended soldering profiles to ensure proper bonding and reliability.
    • Avoid excessive heat and mechanical stress during the mounting process.

(For reference only)