Details

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BUY Q2015L5 https://www.utsource.net/itm/p/12611351.html

Parameter	Description	Value
Part Number	Device Part Number	Q2015L5
Type	Device Type	MOSFET
Package	Package Type	TO-220
VDS (Max)	Drain-Source Voltage (Max)	200 V
VGS (Max)	Gate-Source Voltage (Max)	卤20 V
ID (Max)	Continuous Drain Current (Max)	15 A
RDS(on) (Max)	On-State Resistance (Max) at VGS = 10 V	0.04 惟
Power Dissipation (Max)	Maximum Power Dissipation (at Tc = 25掳C)	150 W
Operating Temperature Range	Operating Junction Temperature Range	-55掳C to 150掳C
Storage Temperature Range	Storage Temperature Range	-65掳C to 150掳C
Gate Charge (Qg)	Total Gate Charge (Max) at VGS = 10 V	50 nC
Input Capacitance (Ciss)	Input Capacitance (Typical) at VDS = 100 V	1500 pF
Output Capacitance (Coss)	Output Capacitance (Typical) at VDS = 100 V	350 pF
Reverse Transfer Capacitance (Crss)	Reverse Transfer Capacitance (Typical) at VDS = 100 V	250 pF

Instructions for Use:

1. Handling Precautions:

   • Handle the device with care to avoid mechanical damage.
   • Use proper ESD protection to prevent damage from static electricity.

2. Mounting:

   • Ensure that the mounting surface is clean and flat.
   • Use a heat sink if necessary to manage thermal dissipation.
   • Apply thermal paste between the device and the heat sink for better heat transfer.

3. Electrical Connections:

   • Connect the drain, source, and gate terminals correctly according to the circuit diagram.
   • Ensure that the gate voltage does not exceed the maximum rating to avoid damage.

4. Thermal Management:

   • Monitor the junction temperature to ensure it remains within the operating range.
   • Consider forced air cooling or other cooling methods if the device is operating near its maximum power dissipation.

5. Testing:

   • Perform initial testing under controlled conditions to verify proper operation.
   • Gradually increase the load to the rated values while monitoring performance and temperature.

6. Storage:

   • Store the device in a dry, cool place away from direct sunlight.
   • Avoid exposure to corrosive environments.

7. Disposal:

   • Dispose of the device according to local regulations for electronic waste.

(For reference only)