Details

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BUY MC145152P https://www.utsource.net/itm/p/12611424.html

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (Vcc)	Operating voltage range	4.5	-	5.5	V
Output Current (Iout)	Maximum output current per pin	-	20	-	mA
Power Dissipation (Pd)	Maximum power dissipation	-	-	625	mW
Operating Temperature (Toper)	Range of operating temperature	-40	-	85	掳C
Storage Temperature (Tstg)	Range of storage temperature	-65	-	150	掳C
Input Voltage (Vin)	Maximum input voltage	-0.3	-	Vcc + 0.3	V
Output Voltage (Vout)	Output voltage range	0	-	Vcc	V
Propagation Delay (tpd)	Time delay from input to output	-	10	-	ns
Quiescent Current (Iq)	Current consumption in quiescent state	-	1	-	mA

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
   • Connect a decoupling capacitor (typically 0.1渭F) close to the Vcc pin to stabilize the power supply.

2. Output Current:

   • Do not exceed the maximum output current of 20mA per pin to avoid damaging the device.

3. Temperature:

   • Operate the device within the temperature range of -40掳C to 85掳C for reliable performance.
   • Store the device in an environment with temperatures between -65掳C and 150掳C.

4. Input Voltage:

   • Ensure that the input voltage (Vin) does not exceed Vcc + 0.3V or go below -0.3V to prevent damage to the device.

5. Output Voltage:

   • The output voltage (Vout) can range from 0V to Vcc, depending on the logic state of the output.

6. Propagation Delay:

   • The typical propagation delay (tpd) is 10ns, which is the time it takes for a change in input to affect the output.

7. Quiescent Current:

   • The device consumes approximately 1mA in the quiescent state.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow proper soldering techniques to ensure good electrical connections and avoid thermal stress.

9. Layout:

   • Use a ground plane to minimize noise and improve signal integrity.
   • Keep signal traces as short as possible to reduce parasitic capacitance and inductance.

10. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets the required specifications.

(For reference only)